MC302 Benchtop Convection Reflow Oven
Design Ideal for Labs and Small-Scale Production
Measuring only 770 mm L x 700 mm W x 480 mm H and weighing under 125 kg, the MC302 easily installs on virtually any benchtop. Its ability to simulate inline reflow profiles with preheat, soak, reflow, and cooling phases makes it a great choice for labs or other installations where space is often at a premium. The front-loading heating chamber has an effective soldering area of 320 mm x 220 mm and includes a window for viewing of the soldering process.
Full Hot-Air Soldering Processing
The new generation MC302 Benchtop Convection Reflow Oven is equipped with a full hot air convection system. Hot air is spread evenly to every corner of the PCB board, avoiding shadow effects and color sensitives to temperature sensing deviation and making the heating efficiency of components consistent.
Exclusive Android-Based Control Application
The MC302 Android-based control app provides an easy-to-use, touch-panel interface with virtual keyboard for setting the temperature and duration of the preheat, soak, reflow, and cooling stages. In the reflow zone, the user can specify the dwell at both the melting and peak temperatures. Based on these settings, the system will also automatically calculate the heating or cooling rate in each stage for verification with solder paste and component manufacturers' specifications. In addition, when heater control is based on the higher temperature measured at the heaters, the system displays the calculated board temperature based on a calibrated offset.
Real-Time Dynamic Thermal Control Via On-Board Measuring
The MC302 Benchtop Convection Reflow Oven has an advanced setting in which you can turn on the real-time dynamic process. The unit can then adjust via real-time feedback from the measuring system which is attached at a strategic location on the PCB surface. The heater control and fan speed are based on the actual temperature measured on the product. The target temperature is equal to the dynamic measuring system temperature and there is no offset, making this a perfect tool for prototyping and small series.
Simulated Multi-Zone Temperature and Time Setting
The MC302 series oven is available to set up the dynamic curve by a maximum of 9 points of temperature and timing simulated to the heating process of a multi-zone reflow oven.
| MC302 Specifications | |
|---|---|
| Applicable Solder Types | Lead-Free and Leaded |
| Heating Method | Full Hot Air Convection |
| User Interface | Android Software Platform Ultra High Resolution Touchscreen Integrated WiFi & Networking |
| PCB Holding Size | 340 mm x 240 mm |
| PCB Effective Heating Area | 320 mm x 220 mm |
| Temperature Range | Ambient ~280 °C |
| Temperature Control Method | Real-time close loop PID temperature control for lead free profile |
| Computer Control | Built-in dual core CPU on board computer |
| Display Panel | 7" Touch screen high resolution LCD display |
| Temperature Control Setting | Quick smart profile programming by temperature rising rate control (degree change per second) |
| Temperature Profile Display | Real-time temperature profile display |
| Temperature Profile Printing | WIFI temperature profile printing |
| Storage | External data storage via WIFI connection |
| Power | 8400W |
| Voltage | 220 V, Single Phase, 50/60 Hz, 35A |
| Dimensions | 770 mm L x 700 mm W x 480 mm H |
| Weight | Approx. 125 kg |
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