AP435 Automatic Inline Stencil Printer for PCB Assembly

Manncorp AP435 Automatic Inline Stencil Printer

The AP435 is Manncorp's best-selling and most versatile high-precision, fully automatic SMT stencil printer engineered for medium- to high-volume production. With a generous print area of up to 400 x 340 mm, it supports stencil sizes from 470 x 370 mm to 736 x 736 mm, offering exceptional flexibility across a wide range of applications. Advanced vision alignment with high-performance cameras ensures fast and accurate PCB positioning, while the 4-point ball-screw drive and programmable speed control for both the blades and stencil-to-PCB separation deliver consistent, high-quality prints. Reliable, precise, and user-friendly, the AP435 provides the performance, repeatability, and versatility required for today's demanding SMT production lines.

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Chris Ellis - East Coast

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Environmental Monitoring for Process Stability

The AP435 features an advanced environmental monitoring system that continuously tracks temperature, humidity, and squeegee pressure during production. By monitoring these parameters, the system helps prevent accelerated oxidation and degradation of solder paste while ensuring stable print performance. By monitoring squeegee pressure, the system guarantees consistent deposition across every board, maintaining uniform print quality even in demanding production environments. This real-time monitoring not only protects solder paste integrity but also enhances overall process stability, yield, and long-term reliability of assembled PCBs.

Parallel Lift System for Superior Print Quality and Throughput

The AP series stencil printers feature a parallel stencil-to-PCB lift system that ensures uniform separation across the entire print area, delivering consistently high print quality even on demanding applications. By maintaining precise, controlled movement during the separation process, the system minimizes paste smearing, reduces defects, and supports accurate printing of fine-pitch components and complex board designs. This reliability not only improves yield but also shortens rework cycles, resulting in higher throughput and greater overall efficiency for modern SMT production lines.

Automatic Solder Paste Application System

The automatic solder paste application system streamlines production by automatically refilling solder paste, reducing manual labor and downtime. Designed to work with standard 500-gram containers, the unit is conveniently mounted on the front of the machine for quick access and easy maintenance. This setup not only simplifies paste handling but also minimizes mess and waste, ensuring a cleaner, more efficient printing process.

Fast and Easy Setup for Precision Printing

The AP Series Printers are designed to deliver both speed and accuracy, minimizing setup time while ensuring repeatable, high-quality results. Operators only need to input the stencil size and secure it in the frame clamp; from there, the intelligent control software automatically manages system calibration and alignment, guaranteeing consistent precision across production runs. Changeovers are completed within seconds, significantly reducing downtime and operator error. The universal frame holder provides stable, vibration-free support for both single- and double-sided PCBs without requiring additional tools, maintaining exact registration even on complex boards. This advanced automation ensures efficient workflow, superior print accuracy, and maximum throughput for demanding SMT production environments.

User-Friendly Programming and Control

Our Windows-based platform makes setup simple, enabling your printer to be fully operational within minutes of installation. All key parameters-such as print speed (programmable from 10 to 120 mm/s), stroke length, squeegee pressure, and more-are easily configured through the intuitive graphical user interface. During operation, the on-screen display provides real-time visibility of job details and process status, ensuring smooth control and maximum efficiency throughout every print cycle.

Dual-Squeegee Drive and Control System

The machine utilizes a dual-squeegee configuration driven by high-precision ball-screw actuators with programmable transport speeds for repeatable motion control. Print pressure is regulated through a uniform force distribution system, while self-leveling squeegees compensate for stencil surface variations in real time to maintain accurate registration and consistent print quality across all cycles. Together, these features provide increased process stability and enable a higher overall throughput rate.

Integrated Under-Stencil Cleaning System

The AP435 features an automatic wet/dry/vacuum under-stencil cleaning system that ensures consistent print quality and minimizing downtime. The programmable system allows flexible cleaning modes, including dry wiping, wet wiping with solvent, or wet wiping combined with vacuum suction to effectively remove solder paste and debris from stencil apertures, maintaining optimal performance throughout production.

AP435 Specifications
PCB Min Size	2" x 2" (50 mm x 50 mm)
PCB Max Size	15.7" x 13.4" (600 mm x 600 mm)
Board Thickness	.015" to .24" (0.4 mm to 6 mm)
Stencil Frame Size (External) Min.	18.5" x 14.56" (470 mm x 370 mm)
Stencil Frame Size (External) Max.	29" x 29" (736 mm x 736 mm)
Flexible holder for single and double-sided PCBs	Yes
PCB Warpage	< 1% of PCB diagonal line
Print Repeatability	0.00039" (± 0.01 mm)
Print Accuracy	0.00098" (± 0.025 mm)
Print Speed	6-200 mm/s (Servo controlled)
Transport Cycle Time	7s (Exclude printing & cleaning)
Transport Height	35" ± 1.6" (900 mm ± 40 mm)
Transport Direction	Left-Right, Right-Left, Right-Right, Left-Left
Transport Speed	60 in/s (1500 mm/s) Max
PCB Fixture	Side clamp, magnetic support pins, vacuum tooling
Support System	Transport rail & vacuum
Interface	SMEMA
Squeegee Type	Metal/Plastic (45°/55°/60°) Fixed
Squeegee Pressure	0-33 lbs (0-15kg) Motorized Control
Print Type	Single and double sided printing
Cleaning Systems	Dry/Wet/Vacuum - Integrated
Camera/FOV	CCD/FOV 7x9 mm
Fiducial Type	Circular/Square/Triangle/Rectangle
Fiducial Size	0.019" to 0.12" (0.5 mm to 3 mm)
X Adjustment	± 0.39" (10 mm)
Y Adjustment	± 0.39" (10 mm)
R Adjustment	± 2°
Environmental Monitoring	Temperature, Humidity & Pressure Monitoring
Operating System	Industrial PC with Windows 10
Power Specs	230V, 50/60 Hz 3KW
Air Requirements	75 psi (5.5 bar)
Dimensions	48" x 54" x 57" (1220 mm x 1373 mm x 1450 mm)
Weight	2200 lbs (1000 kg)

Options
Automatic Paste Dispenser	Jar (59 mm dia x 79 mm) 500 gram
Automatic Glue Dispenser	Yes
2D Inspection	Yes

AP435 Automatic Inline Stencil Printer

AP435 Automatic Inline Stencil Printer

Environmental Monitoring for Process Stability

Parallel Lift System for Superior Print Quality and Throughput

Automatic Solder Paste Application System

Fast and Easy Setup for Precision Printing

User-Friendly Programming and Control

Dual-Squeegee Drive and Control System

Integrated Under-Stencil Cleaning System

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AP435 Automatic Inline Stencil Printer