Back
Parallel Lift System for Superior Print Quality and Throughput
The AP series stencil printers feature a parallel stencil-to-PCB lift system that ensures uniform separation across the entire print area. This controlled movement supports consistent print quality, even for demanding applications and complex board designs.
- Uniform stencil separation: maintains even lift across the full print area
- Reduced defects: minimizes paste smearing and improves print accuracy
- Supports fine-pitch printing: enables reliable results for complex boards
- Improved yield: reduces rework by maintaining consistent print integrity
Dual-Squeegee Drive and Control System
The AP Series uses a dual-squeegee system with high-precision ball-screw actuators to ensure controlled, repeatable motion during printing. This system maintains consistent pressure and adapts in real time to stencil variations for reliable, high-quality results.
- Precision motion control: ball-screw actuators with programmable transport speeds ensure repeatable, accurate squeegee movement
- Uniform pressure distribution: maintains consistent print pressure across the entire stencil
- Self-leveling squeegees: automatically adjust to stencil surface variations to preserve alignment and print accuracy
- Stable process control: enhances consistency across print cycles
Environmental Monitoring for Process Stability
The AP435 features an advanced environmental monitoring system that continuously tracks temperature, humidity, and squeegee pressure during production. This ensures stable print conditions and helps protect solder paste integrity throughout the process.
- Prevents paste degradation: temperature and humidity monitoring help reduce oxidation and maintain paste performance
- Consistent deposition: squeegee pressure control ensures uniform paste application across every board
- Stable print performance: maintains reliable output even in demanding production environments
- Higher yield and reliability: supports consistent quality and long-term PCB performance
Integrated Under-Stencil Cleaning System
The AP435 features an automatic under-stencil cleaning system designed to maintain consistent print quality while reducing downtime. The programmable system supports multiple cleaning methods to effectively remove solder paste and debris during production.
- Flexible cleaning modes: supports dry wiping, wet wiping with solvent, and wet + vacuum cleaning for different production needs
- Effective debris removal: clears solder paste and residue from stencil apertures to maintain print quality
- Reduced interruptions: automated cleaning minimizes manual stops during production
- Optimized cleaning performance: compatible with recommended solutions such as Zestron Vigon SC200
Automatic Solder Paste Application System
The automatic solder paste application system streamlines production by automatically refilling solder paste, reducing manual labor and minimizing downtime. Designed for ease of use, the unit supports standard 500-gram containers and is mounted on the front of the machine for quick access and maintenance.
- Automated paste refilling: reduces manual intervention and keeps production running smoothly
- Standard container compatibility: works with 500-gram solder paste containers for easy integration
- Accessible front-mounted design: allows quick access for maintenance and refills
- Cleaner operation: minimizes mess and waste while maintaining consistent material flow
Fast and Easy Setup for Precision Printing
The AP Series printers are designed to minimize setup time while maintaining precise, repeatable print performance. Operators simply input the stencil size and secure it in the frame clamp, while the system automatically manages calibration and alignment.
- Quick setup process: simple stencil input and clamping reduce setup time and operator effort
- Automated calibration and alignment: ensures consistent precision across production runs
- Fast changeovers: completes transitions in seconds to reduce downtime and operator error
- Stable, tool-free support: universal frame holder ensures secure positioning for single- and double-sided PCBs
User-Friendly Programming and Control
The AP Series uses an intuitive Windows-based interface that simplifies setup and operation, allowing the system to be up and running within minutes.
- Easy parameter control: configure print speed (10–120 mm/s), stroke length, squeegee pressure, and more through a graphical interface
- Real-time process visibility: on-screen display shows job status and key production details during operation
- Efficient operation: streamlined controls help maintain smooth, consistent print cycles
| AP435 Specifications | |
|---|---|
| PCB Min Size | 2" x 2" (50 mm x 50 mm) |
| PCB Max Size | 15.7" x 13.4" (400 mm x 340 mm) |
| Board Thickness | .015" to .24" (0.4 mm to 6 mm) |
| Stencil Frame Size (External) Min. | 18.5" x 14.56" (470 mm x 370 mm) |
| Stencil Frame Size (External) Max. | 29" x 29" (736 mm x 736 mm) |
| Flexible holder for single and double-sided PCBs | Yes |
| PCB Warpage | < 1% of PCB diagonal line |
| Print Repeatability | 0.00039" (± 0.01 mm) |
| Print Accuracy | 0.00098" (± 0.025 mm) |
| Print Speed | 6-200 mm/s (Servo controlled) |
| Transport Cycle Time | 7s (Exclude printing & cleaning) |
| Transport Height | 35" ± 1.6" (900 mm ± 40 mm) |
| Transport Direction | Left-Right, Right-Left, Right-Right, Left-Left |
| Transport Speed | 60 in/s (1500 mm/s) Max |
| PCB Fixture | Side clamp, magnetic support pins, vacuum tooling |
| Support System | Transport rail & vacuum |
| Interface | SMEMA |
| Squeegee Type | Metal/Plastic (45°/55°/60°) Fixed |
| Squeegee Pressure | 0-33 lbs (0-15kg) Motorized Control |
| Print Type | Single and double sided printing |
| Cleaning Systems | Dry/Wet/Vacuum - Integrated |
| Camera/FOV | CCD/FOV 7x9 mm |
| Fiducial Type | Circular/Square/Triangle/Rectangle |
| Fiducial Size | 0.019" to 0.12" (0.5 mm to 3 mm) |
| X Adjustment | ± 0.39" (10 mm) |
| Y Adjustment | ± 0.39" (10 mm) |
| R Adjustment | ± 2° |
| Environmental Monitoring | Temperature, Humidity & Pressure Monitoring |
| Operating System | Industrial PC with Windows 10 |
| Power Specs | 230V, 50/60 Hz 3KW |
| Air Requirements | 75 psi (5.5 bar) |
| Dimensions | 48" x 54" x 57" (1220 mm x 1373 mm x 1450 mm) |
| Weight | 2200 lbs (1000 kg) |
| Options | |
| Automatic Paste Dispenser | Jar (59 mm dia x 79 mm) 500 gram |
| Automatic Glue Dispenser | Yes |
| 2D Inspection | Yes |
