Flexibility for Virtually Any Wave Soldering Requirement
The standard solder module is supplied in wave configuration to accommodate both conventional and surface mount assemblies and is driven by two, heavy-duty, transducer-controlled, 1/4 HP motors to ensure precise, uniform wave heights.
The chip wave is the primary wave. Its turbulent wave crest ensures complete solder coverage, eliminating the risk of solder skips. The second wave ensures adequate drainage of excess solder from the joints to prevent bridging and solder accumulation.
The chip wave can be deactivated through the user interface for non-SMT applications, although the addition of an oscillating wave option allows the chip wave to aid in hole fill and bridge reduction for difficult-to-solder boards of all technologies.
The standard maximum wave width of 410 mm (16") can be adjusted, relative to PCB dimensions, through the use of an optional wave reducer mechanism and helps to minimize dross formation.
Finally, board interval sensing for wave activation and an energy-saving standby mode aid in dross reduction.
Dual pot option allows leaded and lead-free solders to be run in the same machine
The Manncorp 32.400 comes standard with a high-capacity (420 kg approximate weight for lead free solder), titanium-alloy solder pot suitable for handling leaded or lead-free solders, mounted to a heavy-duty, carriage assembly with motorized Y-axis and Z-axis controls for easy access and maintenance.
An available dual-pot option allows the solder pot and carriage to be easily switched out for another carriage and pot containing a different solder composition, a valuable option for assemblers transitioning from lead-based to lead-free solders or contractors who receive jobs that still use tin/lead solder.
High-Precision Automatic Spray Fluxing and Three-Zone Hot-Air Convection Preheating
The 32.400 includes an automatic internal spray fluxing system that features a precision spray nozzle assembly mounted to a reciprocating Y-axis drive mechanism to ensure even and accurate application of flux. The system adjusts automatically to accommodate the PCB size and utilizes a high-precision, low-pressure atomizer to provide excellent coating and through-hole penetration.
After flux application, boards enter a three-zone, high-capacity, forced hot air convection preheater with independent zone temperature controls to allow precise thermal profiling for proper flux activation and optimal solder wetting as assemblies enter the wave module.
If additional profiling control is needed, or for assemblies sensitive to top and bottom side temperature differential, an additional top-side preheater can be added at minimal cost.
Avoid Contamination When Switching Flux Types With Optional Dual-Fluxer
Dual spray fluxers permit instant and easy switchover from one flux type to another without messy clean-ups. Two separate nozzles, two flux tanks and two lines prevent any commingling of fluxes, regardless of differing chemistries.
Titanium Finger Conveyor Includes Motorized Width Adjustment
Motorized conveyor width adjustment, from 50-400 mm (2" - 15.75"), is standard on all 32.400 Wave Soldering Systems, dramatically reducing setup time and eliminating operator inconsistency. Other conveyor widths are available: 300 mm, 350 mm and 450 mm.
An aluminum-alloy pin-type conveyor input mechanism feeds the dual-titanium-finger conveyor which includes a built-in finger cleaner, closed-loop speed control and overload protection.
Conveyor angle is adjustable from 4° - 7° and nominal speed setting is variable from 0.5 - 2.2 m/min (20" - 87"/min) for maximized throughput.
An optional center PCB support rail can be added to maintain planarity and to prevent sagging of oversize boards through the wave module.
Automate Production with Inlet and Unload Conveyors
Manncorp's WL-100M-L1 inlet conveyor and WU-120M-H1 belt unloader are specially designed for wave solder systems.
WL-100M-L1 is a fully adjustable, chain-type inlet conveyor designed for feeding assemblies up to 350 mm (13.78") wide directly into the wave solder machine. Travel speed, conveyor angle and conveyor height are all adjustable. Construction is heavy-duty aluminum.
WU-120M-H1, with its non-slip, heat-resistant belt, unloads soldered assemblies from wave soldering equipment. Height, angle and speed are adjustable. The speed is variable from 0.5-8 m/min so that PCBs are transferred smoothly and safely from the wave soldering system to operators or other handling equipment of the user's choice.