The SDM313 cleanly separates even metal-core PCBs, such as those used in LED applications, as well as ultra-thin and flexible boards down to 0.5 mm thick—without damaging delicate components located just 0.5 mm from the score line. Its linear cutting blades reduce stress and enable fast, precise separation, while a top-mounted knob allows for easy alignment. With a maximum 4 mm blade gap, the design also prioritizes operator safety.
SDM313 SPECIFICATIONS | |
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PCB Thickness | 0.5-2.0 mm |
Max PCB Width | Unlimited |
Max PCB Length | 300 mm |
Score Angle | 20˚ |
Minimum Component Distance to V-Groove |
0.5 mm |
Max Component Height | .79" (20 mm) |
PCB Materials | All Materials Including Aluminum |
Separating Speed | N/A |
Depaneling Mode | Pneumatic |
Production Volume | High |
Power | 60 to 80 psi (4 to 6 bar) |
Dimensions | 10.1" x 23.4" x 14.9" (259 x 595 x 380 mm) |
Net Weight | 309 lbs (140 kg) |
Shipping Weight | 366 lbs (166 kg) |