The SDM313 cleanly separates metal-core PCBs—including LED boards—as well as ultra-thin and flexible substrates down to 0.5 mm, without damaging components located just 0.5 mm from the score line.
- Handles metal-core PCBs: ideal for LED applications
- Ultra-thin capability: processes boards down to 0.5 mm thick
- 0.5 mm component clearance: supports high-density designs
- Low-stress linear blades: fast, precise, and damage-free separation
- Top-mounted adjustment knob: quick and easy alignment
- Max 4 mm blade gap: enhanced operator safety
This combination of precision cutting and low-stress operation ensures consistent, high-quality results across a wide range of PCB materials and applications.
| SDM313 SPECIFICATIONS | |
|---|---|
| PCB Thickness | 0.5-2.0 mm |
| Max PCB Width | Unlimited |
| Max PCB Length | 300 mm |
| Score Angle | 20˚ |
| Minimum Component Distance to V-Groove |
0.5 mm |
| Max Component Height | .79" (20 mm) |
| PCB Materials | All Materials Including Aluminum |
| Separating Speed | N/A |
| Depaneling Mode | Pneumatic |
| Production Volume | High |
| Power | 60 to 80 psi (4 to 6 bar) |
| Dimensions | 10.1" x 23.4" x 14.9" (259 x 595 x 380 mm) |
| Net Weight | 309 lbs (140 kg) |
| Shipping Weight | 366 lbs (166 kg) |