MX1 X-Ray Inspection System

MX1 X-Ray Inspection System

High-performance X-ray inspection for dense PCB assemblies.

The MX1 delivers real-time imaging for multilayer boards and advanced packages, ensuring accurate defect detection.

  • 80kV X-ray source: powerful inspection of dense assemblies
  • 10 µm focal spot: high-resolution defect detection
  • Wide magnification: 4x–100x geometric, up to 225x optical
  • Defect analysis: detects voids, bridging, and missing balls
  • Angle viewing: 45° wedge + variable angle inspection
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Questions? Reach Out Directly:

Chris Ellis - East Coast

Sales & Operations Manager

215.869.8374

Ed Stone - West Coast

Sales Manager

215.808.6266

Difference In Magnification

These images compare a standard 80 kV x-ray tube (35 µm focal spot, left) with an upgraded 10 µm focal spot system (right), showing significantly higher detail and magnification up to 225X.

MX1 X-Ray Inspection Exposes Hidden BGA Flaws

The MX1 detects hidden BGA defects including missing balls, misalignment, bridging, and internal voids.

MX1 Specifications
Contrast ResolutionCan resolve 0.001 gold wire
Spatial Resolution100 line-pairs/mm
Anode Voltage80kV
Anode Current150 microamps (internal adjustment)
Focal Spot Size10 μm
Focal Spot to Image Plane Distance4-6" (101.6 mm - 152.4 mm)
XRTV Zoom Camera4X - 225X optical magnification (standard)
Up to 100x geometric magnification
X-Y Positioner Range14" x 14" (356 mm x 356 mm)
Operating Voltage120v/220v, 50-60hz
Dimensions50" H x 60" W x 33" D
(1270 mm x 1524 mm x 838.2 mm)

MX1 X-Ray Features

  • High voltage 80 kV x-ray tube w/ 10 µm focal spot
  • XRTV high-sensitivity x-ray camera w/ 4X-225X optical magnification and up to 100X geometric magnification
  • Motorized X-Y positioner
  • Includes wedge for 45° viewing angle (when used it will operate at 15x geometric magnifcation)
  • Safety shielded work area
  • Powerful, easy-to-use, image-processing software
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