SDM223 Motorized PCB Depaneler

SDM223 Motorized PCB Depaneler

The SDM223 Motorized PCB Depaneler delivers clean, burr-free separation of V-groove PCBs with minimal stress, preventing solder joint microcracks and substrate delamination—even with components just 1 mm from the score line. It supports boards up to 400 mm (15.7") long and components up to 32 mm tall, making it ideal for high-density assemblies. Featuring a motorized lower blade, adjustable upper blade, and cutting speeds up to 350 mm/sec, the SDM223 combines precision, durability, and ease of use for any modern production line.

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Chris Ellis - East Coast

Sales & Operations Manager

215.869.8374

Ed Stone - West Coast

Sales Manager

215.808.6266

The SDM223 is designed for fast, safe, and precise depaneling of pre-scored (V-groove) printed circuit boards. Its dual circular blade system ensures clean separations while minimizing mechanical stress, making it suitable for populated boards with components placed as close as 1 mm to the V-groove.

During operation, the user simply aligns the board along the extended lower guide. The upper blade is easily adjusted to match board thickness using a rotary knob with a secure locking mechanism. Once set, the motorized lower blade pulls and cuts the PCB while the free-rotating upper blade glides along the score line, maintaining proper alignment and cutting depth. This process ensures a consistent, damage-free edge—free of burrs, cracks, or substrate delamination.

The SDM223 accommodates boards up to 400 mm (15.7") long and 32 mm tall, with adjustable cutting speeds from 0 to 350 mm/sec (13.8"/sec) to match material type and production requirements. Its robust construction includes hardened tool steel blades, safety shielding, and a durable frame for long-term reliability with minimal maintenance.

An optional sliding worktable with a fixture is available to further enhance stability and throughput in higher-volume operations.

Whether used for prototyping or production, the SDM223 is a cost-effective solution for depaneling high-density PCB assemblies with speed, safety, and precision.

SDM223 SPECIFICATIONS
PCB Thickness 1.0 mm to 3.0 mm
Max PCB Width Unlimited
Max PCB Length 15.7" (400 mm)
Score Angle 20˚
Minimum Component
Distance to V-Groove
1 mm
Max Component Height 1.26" (32 mm)
PCB Materials Anything but Aluminum
Separating Speed 0-13.8"/sec (350 mm/sec)
Depaneling Mode Motorized
Production Volume Low to Moderate
Power 110V, 60Hz, 1.6A
Dimensions 10.2" x 25.7" x 13.6" (260 x 653 x 346 mm)
Net Weight 106 lbs (48 kg)
Shipping Weight 161 lbs (73 kg)

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