16.350 Ultra Compact Wave Solder

Ultra Compact Wave Soldering Machine 16.350 from Manncorp
Ultra Compact Wave Soldering Machine 16.350
Ultra Compact Wave Soldering Machine 16.350
Ultra Compact Wave Soldering Machine 16.350
Ultra Compact Wave Soldering Machine 16.350
Ultra Compact Wave Soldering Machine 16.350
Ultra Compact Wave Soldering Machine 16.350
Ultra Compact Wave Soldering Machine 16.350
Ultra Compact Wave Soldering Machine 16.350
Ultra Compact Wave Soldering Machine 16.350

16.350 Ultra Compact Wave Solder

The 16.350 wave soldering machine brings complete through-hole, surface mount and mixed-technology wave soldering capability to manufacturers with limited floor space. Capable of soldering 1,500 assemblies per 8-hour shift, the 16.350 includes as standard a number of advanced features, like dual waves, a self-cleaning titanium finger conveyor, spray fluxer, forced hot air convection pre-heat, and an energy-saving mode that conserves power and reduces dross formation.

This item ships by freight. If you purchase it through our online store, our sales team will send you a quote for the freight costs after purchase.

Regular price $36,995.00
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QUESTIONS? TEXT OR CALL:
Chris Ellis  215-869-8374 | East Coast
Ed Stone 215-808-6266 | West Coast

Lead-free or Tin-lead Through-hole Soldering

The 16.350's adjustable dual waves permit lead-free or tin/lead processing of through-hole and SMD boards to a maximum width of 350 mm x 350 mm (13.75" sq.).

As PCBs are loaded onto the adjustable titanium finger conveyor, they are automatically prepped by an adjustable internal spray fluxing system which houses a precision spray nozzle assembly mounted to a reciprocating Y-axis drive mechanism to ensure even and accurate application of flux.

Run as Dual or Single Wave

Solder processing temperature is settable to a lead-free compatible 300°C. The system includes an economical low-volume 250 kg (550 lbs. Approximate weight for lead free solder) capacity solder pot with an easy-handling roll-out feature. A built-in alarm signals when solder level is at the refill point.

16.350 features dual wave soldering for through-hole and surface mount soldering. The chip wave provides a turbulent wave crest to ensure complete coverage of every joint, eliminating solder skip defects. It's followed by a secondary wave that facilitates the draining of excess solder away from the joints, preventing bridging and solder accumulation.

Wave angle is adjustable, and the chip wave can be deactivated through the user interface for non-SMT applications.

A second solder pot is available, with quick-connect capability, to allow for fast changeover between leaded and lead-free solders.

Forced Hot Air Convection Pre-Heat

The preheat stage takes place in a 600 mm (23.6") glass-covered chamber where boards are heat-bathed by energy-saving forced hot air convection, as opposed to power-consuming, uneven IR heat.

Self-Cleaning Titanium Finger Conveyor

To maximize throughput, conveyor speed setting is variable from 0.5 – 2.2 m/min (20" – 87"/min).

An optional center PCB support rail can be added to maintain planarity and prevent sagging of oversize boards through the wave module.

An automatic finger cleaner for the conveyor's titanium fingers is included.

Fully Supported

16.350 comes with a one-year parts warranty plus email and telephone support provided by factory-trained Manncorp technicians. Onsite installation and training is also available.

16.350 Specifications
Solder Capacity*250 kg (Approximate weight for lead free solder)
WaveDual Wave
Dual Pot CapableYes - Option
Pb Free CapableYes
PreHeat TypeConvection
PreHeat Length600 mm
System ControlTouch Screen Control
FluxerSpray Fluxer
ConveyorTitanium V-Shaped Finger
Finger CleanerYes
Max. Board Width350 mm
Fume ExtractionExtractor Hood and Filter
Overall Dimensions2550 mm (L) x 1150 mm (W) x 1650 mm (H)
(100" L x 45.2" W x 65" H)
Machine Weight360 kg (794 lbs)
Power 3Φ220V
Current50A
Frequency60Hz
Total Power18 kw
Air Pressure4 kfg/cm2
Rosin Atomization DeviceStepping Motor
Conveying Rate0.5~2.2 M/min
Solder Wave Width360 mm
Bare Board DimensionsMax 350 mm x 350 mm
Length of Solder PinMax 10 mm
Solder Furnace TemperatureRoom Temperature~300°C
Exhaust Fan400W 1Φ220V
Solder Furnace Motor180W*2
Drive Motor40W 1Φ220V
Heating Pipe of Preheater1.5 kw*6
Pawl Cleaning Pump12W
Forced Cooling Fan45W
Output1500Pcs /8H

*Capacity is calculated for lead-free solder. Leaded solder is higher.

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