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Highly Responsive Solder Pump for Precise Wave Control
The TRZ’s programmable solder pump delivers precise, real-time control of wave height and solder volume through adjustable speed and acceleration settings.
- Fast response: instant control of wave height and flow
- Stable wave form: consistent solder delivery
- Programmable control: optimized for different applications
An integrated nitrogen micro-heater (up to 400°C) surrounds the nozzle, maintaining stable temperature and reducing oxidation for consistent solder quality.
Solder Connectors with Parallel Rows of Pins in a Single Pass
Multiple rows of connector pins can be soldered in a single pass using appropriately sized nozzles, significantly improving throughput.
- Large-ID nozzles: handle multiple leads simultaneously
- Custom nozzle options: available for specific applications
- Higher throughput: fewer passes required
Nozzle selection depends on pad area, component spacing, and desired production speed.
Wide Variety of Quick-Change Nozzles Available
A wide range of precision nozzles allows the system to adapt to different soldering requirements.
- Sizes from 2.5–20 mm: flexible application coverage
- Polished stainless steel: smooth, laminar wave flow
- Stable wave temperature: consistent soldering results
Nozzle diameter directly controls wave size and solder coverage area.
Compact Solder Pot Slides In and Out for Easy Maintenance
The compact 16 kg solder pot remains stationary during operation while the PCB moves in XYZ axes for precise positioning.
- Slide-out design: fast access for maintenance
- Compact footprint: efficient benchtop operation
- Stable process: consistent solder conditions
Optional features include a low solder level alarm and automatic solder feeder.
View and Record Live Video of Soldering Operations
An optional high-definition camera system provides real-time visibility of the soldering process.
- Live monitoring: view solder joints during operation
- Recording capability: supports training and validation
- Adjustable lighting: clear inspection of the soldering area
Generate Program Data From PCB Scans or Gerber Data Import
Programs can be created quickly using multiple input methods, including Gerber files or PCB images.
- Gerber import: automatic PCB mapping
- Image-based setup: create programs from scanned boards
- Offline programming: build programs on any PC
Programs are transferred via USB and can also be adapted for selective fluxing applications.
Wave Simulation Mode Checks Solder Coverage Area
The wave simulation tool allows users to verify solder coverage before running production.
- Coverage preview: visualize wave width and reach
- Nozzle-based simulation: accurate representation
- Pre-production validation: reduces setup errors
Editable Parameters for Complete Control of All Soldering Functions
The TRZ software provides detailed control over every step of the soldering process.
- Adjustable parameters: Z-height, dwell time, XY speed
- Pump control: flow rate and acceleration
- Defect prevention: minimizes bridging and icicling
All data is organized automatically, and total program time is calculated for efficient planning.
Easy Import and Conversion of Gerber Data Into Soldering Programs
Imported Gerber data is automatically converted into an editable PCB layout.
- Visual editor: select pads directly
- Point or line definition: flexible solder path creation
- Fast setup: reduces programming time
Selective Fluxing System Supports Up to 3 TRZs
The optional ULTIMA SSP system provides precise, programmable fluxing for enhanced process control.
- Pressurized atomization: accurate flux delivery
- Programmable XY motion: targeted application
- Multi-machine support: operates up to three TRZ systems
| PCB HOLDER AND X-, Y-, Z-AXIS DRIVE MECHANISM | |
|---|---|
| Maximum PCB Size | 330 mm x 250 mm (13" x 10") |
| Minimum PCB Size | 50 mm x 50 mm (2" x 2") |
| PCB Thickness | 0.8 mm - 2.0 mm (0.032" - 0.080") |
| Maximum PCB Weight | 2 kg (4.4 lbs.) including components; 4 kg (8.8 lbs.) capacity optional |
| Component Lead Length | 3 mm (0.12") recommended maximum |
| Component Height (Top Side) | 50 mm (2") maximum above PCB top side |
| Component Height (Bottom Side) | 25 mm max |
| PCB Edge Clearance | 3 mm (0.12") for components 5 mm (0.20") for solder pad edge |
| SOLDER WAVE AND BATH | |
| Solder Types | Both Lead-Free and Conventional Sn/Pb Solders; Second Separate Solder Pot Recommended When Using Both Types |
| Wave Diameter | Nozzle Dependent Based on Inner Diameter (2.5, 3.0, 4.0, 5.0, 6.0, 7.0, 8.0, 9.0, 10.0, 12.0, 14.0, 16.0, 20.0 mm Inner Diameter Nozzles Available) |
| Solder Wave Height | 4 mm (0.16") maximum |
| Solder Wave Height Adjustment | Controlled by Pump Motor RPM |
| Solder Wave Height Accuracy | ±0.3 mm (±0.012") |
| Solder Capacity | Approx. 16 kg (35 lbs.) |
| Solder Melting Method | Indirect Heating with Cartridge Heaters |
| Solder Temperature | Ambient to 300°C |
| Solder Melt Time at Startup | Approx. 30 min. |
| CONTROLLER | |
| Program Storage | Internal Memory for 50 Files, 200 Steps Per File; Unlimited Off-Line Storage with PC Connected via USB Port and Windows®-Based Software |
| User Interface | Touch Screen LCD Display Base; Windows®-Based Software for Off-Line Programming and Data Transfer |
| UTILITIES/FACILITIES REQUIREMENTS | |
| Machine Dimensions | 940 mm L x 620 mm W x 442 mm H (37" x 24.5" x 17.4") |
| Machine Weight | 120 kg (264.5 lbs.) Including 16 kg (35 lbs.) Solder Capacity |
| Power Source | 200-220 VAC, Single Phase, 50/60 Hz, 4 KVA |
| Nitrogen Supply | 0.4 - 0.5 MPa (60-75 psi); 25 l/min (0.9 CFM) |
ULTIMA TRZ Features
- Eliminates Time-Consuming Hand Soldering Operations and Expensive Wave Soldering Fixtures; Reduces the Risk of Component Overheating and PCB Damage
- High-Precision X-Y-Z-Axis Drive Moves PCB Over Stationary Solder Pot, Allowing a Compact, Bench-Top Design Weighing Less Than 120 kg (265 lbs.)
- Flexible PCB Holder with Quick-Release Cam-Locks for Fast Loading and Unloading, Handles Boards Up to 330 mm x 250 mm (13" x 10")
- Integral Wave Nozzle Hood, with Built-In Micro-Preheater Controllable to 400 °C, Shrouds Soldering Site with Inert Nitrogen and Prevents Oxidation
- Bottom-Side Witness Camera Option for Real-Time Video Inspection of Soldering Process via USB Connection
- Fully Programmable Point-to-Point or Drag Solder Functions, Variable Solder Pump Speed and Wave Height Control, and a Wide Variety of Dip Height and Dwell Parameter Settings
- Windows?-Based Software for Off-Line Programming, Data Transfer, and Unlimited Program Storage via USB Connection
- Optional Software for Fast Program Generation via Gerber Data Import or Scanned PCB Image
- Nozzle Diameters From 2.5 mm to 20 mm (0.1" to 0.79")
- Designed for Both Lead-Free and Conventional Sn/Pb Solders
ULTIMA SSP Benchtop Selective Fluxing Machine
- High-Precision, Pressurized Air Atomization Nozzles and Programmable X-Y Drive Mechanism for Highly Controllable Selective Fluxing
- Utilize Selective Soldering Data From TRZ to Generate Selective Fluxing Programs; Easily Download Data to SP Fluxer Using Windows™-Based Software and USB Interface
- Flexible PCB Holder Handles Boards or Pallets Up to 330 mm x 250 mm (13" x 10")
- Support Three or More TRZ Selective Soldering Systems with a Single SSP Fluxer
- Keep Overspray and Sticky Flux Residue Away From Selective Soldering Equipment to Simplify Maintenance and Reduce Downtime
- Weight Less Than 45 kg (100 lbs.)
- Built-In Flux Reservoir with Hi-Level/Low-Level Alarms
- Integral, 97 mm Diameter (4") Port for Connection to Factory Exhaust
Separate Fluxing Station Provides Important Advantages
The ULTIMA SSP handles boards or pallets up to 330 x 250 mm (the same size as the TRZ) and utilizes a high-precision, pressurized air atomization nozzle and X-Y drive mechanism with programmable speed for highly controllable selective fluxing. Among the many advantages of separating soldering and fluxing operations into separate machines are 1) the ability to keep overspray and sticky flux residue away out of the soldering mechanism and PCB positioner, 2) simplified maintenance, and 3) increased throughput by allowing soldering and fluxing to be performed simultaneously (in fact, a single SSP can serve as many as three TRZ systems).
Precision Spray Nozzle Delivers Precise, Uniform, Flux Application
The precision spray nozzle used in the ULTIMA SSP is capable of delivering round or very thin linear spray patterns with a very small amount of liquid flux. Independent pressure controls for its integral flux reservoir and atomizer allow the user to regulate the volume and density of the spray jet.
Selective Fluxing Programs Easily Generated From Soldering Data
Soldering programs for the TRZ are easily converted to selective fluxing programs by the ULTIMA Series software application and downloaded to the SSP via USB connection.
