16.350 Ultra Compact Wave Solder
The 16.350 wave soldering machine brings complete through-hole, surface mount and mixed-technology wave soldering capability to manufacturers with limited floor space. Capable of soldering 1,500 assemblies per 8-hour shift, the 16.350 includes as standard a number of advanced features, like dual waves, a self-cleaning titanium finger conveyor, spray fluxer, forced hot air convection pre-heat, and an energy-saving mode that conserves power and reduces dross formation.
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- Chris Ellis 215-869-8374
- EAST COAST
- Ed Stone 215-808-6266
- WEST COAST
- Second solder pot for 16.350 + $12,995.00
- Motorized in/out solder pot shuttle for single-pot system for 16.350 + $1,000.00
- Motorized in/out solder pot shuttle for two-pot system for 16.350 + $2,000.00
- Motorized conveyor width adjustment for 16.350 + $1,495.00
Lead-free or Tin-lead Through-hole Soldering
The 16.350's adjustable dual waves permit lead-free or tin/lead processing of through-hole and SMD boards to a maximum width of 350 mm x 350 mm (13.75" sq.).
As PCBs are loaded onto the adjustable titanium finger conveyor, they are automatically prepped by an adjustable internal spray fluxing system which houses a precision spray nozzle assembly mounted to a reciprocating Y-axis drive mechanism to ensure even and accurate application of flux.
Run as Dual or Single Wave
Solder processing temperature is settable to a lead-free compatible 300°C. The system includes an economical low-volume 250 kg (550 lbs. Approximate weight for lead free solder) capacity solder pot with an easy-handling roll-out feature. A built-in alarm signals when solder level is at the refill point.
16.350 features dual wave soldering for through-hole and surface mount soldering. The chip wave provides a turbulent wave crest to ensure complete coverage of every joint, eliminating solder skip defects. It's followed by a secondary wave that facilitates the draining of excess solder away from the joints, preventing bridging and solder accumulation.
Wave angle is adjustable, and the chip wave can be deactivated through the user interface for non-SMT applications.
A second solder pot is available, with quick-connect capability, to allow for fast changeover between leaded and lead-free solders.
Forced Hot Air Convection Pre-Heat
The preheat stage takes place in a 600 mm (23.6") glass-covered chamber where boards are heat-bathed by energy-saving forced hot air convection, as opposed to power-consuming, uneven IR heat.
Self-Cleaning Titanium Finger Conveyor
To maximize throughput, conveyor speed setting is variable from 0.5 – 2.2 m/min (20" – 87"/min).
An optional center PCB support rail can be added to maintain planarity and prevent sagging of oversize boards through the wave module.
An automatic finger cleaner for the conveyor's titanium fingers is included.
16.350 comes with a one-year parts warranty plus email and telephone support provided by factory-trained Manncorp technicians. Onsite installation and training is also available.
|Solder Capacity*||250 kg (Approximate weight for lead free solder)|
|Dual Pot Capable||Yes - Option|
|Pb Free Capable||Yes|
|PreHeat Length||600 mm|
|System Control||Touch Screen Control|
|Conveyor||Titanium V-Shaped Finger|
|Max. Board Width||350 mm|
|Fume Extraction||Extractor Hood and Filter|
|Overall Dimensions||2550 mm (L) x 1150 mm (W) x 1650 mm (H)
(100" L x 45.2" W x 65" H)
|Machine Weight||360 kg (794 lbs)|
|Total Power||18 kw|
|Air Pressure||4 kfg/cm2|
|Rosin Atomization Device||Stepping Motor|
|Conveying Rate||0.5~2.2 M/min|
|Solder Wave Width||360 mm|
|Bare Board Dimensions||Max 350 mm x 350 mm|
|Length of Solder Pin||Max 10 mm|
|Solder Furnace Temperature||Room Temperature~300°C|
|Exhaust Fan||400W 1Φ220V|
|Solder Furnace Motor||180W*2|
|Drive Motor||40W 1Φ220V|
|Heating Pipe of Preheater||1.5 kw*6|
|Pawl Cleaning Pump||12W|
|Forced Cooling Fan||45W|
*Capacity is calculated for lead-free solder. Leaded solder is higher.