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CR-6000 6-Zone SMT Reflow Oven

A combination of high-mass heat sources and efficient thermal transfer allows the CR-6000 to provide excellent reflow soldering results and throughput with a shorter-than-average heating tunnel. Your 6-zone unit also includes advanced features such as a wide combination pin-over-mesh belt conveyor, partnered pre-loaded KIC Auto Focus profile predictions software, and real-time thermal profiling standard.

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Chris — East Coast: 215.869.8374

Ed — West Coast: 215.808.6266

CR-6000 Reflow Soldering Oven

Specifications

General
Lead Free Compatible Yes
Tin Lead (SnPb) Compatible Yes
Nitrogen Atmosphere Compatible Optional
Double-Sided Board Processing Yes
CE Compliance Yes
SMEMA Compatible Optional
Board Handling
Heated Board Width 22.4" (570mm)
Mesh Belt Conveyor Standard
Mesh Belt Width 22.4" (570mm)
Process Clearance Above Mesh Belt 2.5" (65mm)
Chain-Driven Pin Conveyor Standard
Pin Conveyor Max. Width 17.7" (450mm)
Pin Conveyor Min. Width 1.97" (50mm)
Auto Adjust Pin Conveyor Optional
Clearance Above Conveyor Pins 1.18" (30mm)
Clearance Below Conveyor Pins .98" (25mm)
Powered Center Support Optional
Automatic Chain Lubrication Yes
Conveyor Speed 16-71"/min (400-1800mm/min)
Conveyor Height 35.4 ±0.8" (900mm ±20mm)
Conveyor Direction Left to Right
Component Max. Height 30mm upper, 25mm lower
Heating
Forced Hot Air Convection Yes
Number of Independently Controlled Heating Zones 12 total
6 upper, 6 lower
Total Heated Length 80.7" (2050 mm)
Number of Oven Convection Motors 12 Power: 120W x 12
Delta T ±2° C
Temperature Controls
PID (Proportional-Integral-Differential) Yes
Temperature Control Accuracy ±1° C
PCB Temperature Tolerance ±2° C
Temperature Range Ambient -350° C
Ramping Time (from cold start) < 15 min
Profiling / Thermocouple Channels 3
Cooling
Standard Cooling Method Air
Internal Chilled Water Cooling Optional
Number of Cooling Zones 1 (2 with water cooling)
Cooling Tunnel Length 24.4" (620 mm)
Exit Temperature 40°C
Number of Cooling Fans Three 45W or one 370W
Operating System and User Interface
Windows Compatible PC Yes
Touch Screen LCD No
Language English
On-Screen Thermal Profiling and Parameter Setting Yes
Print Capability Yes
Data Logging & Event Recording Yes
Alarms Audible, Visual (Light Tower) and On-Screen Display
Dimensions & Physical Characteristics
Length 164" (4150 mm)
Width 59.4" (1510 mm)
Height 61" (1550 mm)
Net Weight 3329 lbs. (1510 kg)
Utilities
Power Supply 220 VAC 3-Phase
Frequency 60Hz
Operating Power Consumption 8-14 KW
Start-Up Power (Sequential Start-Up Mode*) 25 KW
Current (Sequential Start-Up Mode*) 83A
Total Power (Maximum) 46 KW
N² Consumption 20-30 m3/h (with N² option)
Oxygen Density 300-1000 ppm (with N² only)
Number of Exhaust Vents 3
Exhaust Opening Size 8" diameter
Exhaust Venting Volume 400CFM per port
Conveyor & PC Power Supply Uninterruptible Power Supply for Conveyor & PC
*Sequential Start-Up Mode is the default start-up mode and limits current draw during start-up.
Miscellaneous
Hood Opening Mechanism Automatic Raise and Lower

Details

High-Heat, Lead-Free Soldering in a Shorter Tunnel
Our revolutionary CR-6000 can provide low-, medium-, and high-volume manufacturers in a variety of PCB industries a reliable solution to the challenges posed by lead-free reflow soldering, including higher temperatures and a tighter process window resulting in a low margin for error.

Our 6-zone models are 20%-30% shorter than comparable systems with the same number of zones and commensurate throughput. They also offer a lower price tag than other options on the market, making them a great choice when factory floorspace and budgetary room are both at a premium. The key to this is a proprietary design that features high-mass heat sources combined with efficient thermal heat transfer capabilities, giving you the uniform heating and exceptional process stability that you’re looking for, even in the face of varying loads.
Precise Temperature Profiling
The CR-6000's heating zone temperature controllers have an accuracy of ±1°C and, in conjunction with a high-speed blower adjacent to each heat source for maximum convection, ensure a ΔT of ±2°C across the PCB assembly. The system's diffuser design also provides low-velocity, low-turbulence air flow to prevent component shift or disturbance.

Optional thermocouples can be attached at different, critical locations on the PCB, and connect to three built-in inputs (standard) on the oven for communication with CR Series control software and accurate, real-time temperature profiling to match any solder paste manufacturer's specifications.

Included KIC Auto Focus profile prediction software takes the guesswork out of setting up new profiles: simply select your solder paste formula and process window, specify your physical characteristics, and Auto Focus returns optimal zone temperature and belt speed settings.
Advanced Conveyor Systems
No matter your product specification or production requirement, the standard combination 22” (570 mm) stainless steel mesh belt and adjustable-rail, pin-type conveyor system supplied with the CR-6000 can handle PCBs up to 17.7’ (450 mm) in size at maximum. Conveyor speed is programmable in a range of 16”-71” (400-1800 mm) per minute to accommodate your needs. We also offer options such as automatic width adjustment of the pin conveyor based on specific reflow program parameter settings.

All of the CR-6000’s components are constructed of high-quality, high-strength stainless steel, built to maintain dimensional tolerances at high lead-free processing temperatures while eliminating the possibility of jammed or dropped PCB assemblies.
Nitrogen Atmosphere Compatible
Our models offer nitrogen compatible configurations for manufacturers who want to be flexible in soldering in both air and inert reflow atmosphere environments. Experts agree that oxidation reduction through inert gas (generally N2) introduction allows a wider process window, providing better solder joints. Our nitrogen-configured CR-6000’s heating chamber lends itself to efficient heat transfer and low nitrogen consumption while maintaining O2 levels of 300-1000 ppm through an enhanced flow design.
Critical Cooling Rate Control
Aggressive cooling is often necessary to reduce peak temperature exposure times in lead-free soldering processes due to higher liquidus temperatures approaching the limits of numerous SMT components and PCB assemblies. Our CR-6000 utilizes an internal water-chilled recirculating cooling system which allows our clients to alter cooling rates, meeting solder past manufacturers’ recommendations to a greater degree than possible with exclusive standard air cooling systems.
Process Management Functionality
The CR-6000’s Windows-based oven management software includes advanced temperature profiling, timed automatic startup and shutdown, audiovisual alarms, and password protection functionality. The control of this reflow system is accomplished through an easily navigable user interface featuring a full-screen virtual view of the system and a display of preset and actual zone temperatures, system status readings, and conveyor speeds. Every system features a UPS battery backup that functions in case of a power outage, ensuring the removal of all product from the oven for your safety.

Our PC controller systems offer unlimited storage, networking capabilities, a 15” flat screen monitor, and keyboard and trackball.

Profile Prediction

HOW 'AUTO FOCUS POWER' PROFILE PREDICTION WORKS:

1. Select Your Solder Paste Formula and Process Window
The KIC Auto-Focus Power software includes a database of over 1000 different solder paste formulas from dozens of different solder paste manufacturers. Each database entry includes the manufacturer's recommended solder profile for that specific solder paste formula and identifies critical specifications (i.e. maximum ramp rate, maximum cooling rate, temperatures for preheat, soak, reflow, and peak, allowable times above those temperatures, etc., with upper and lower limits for each) that define the process window. After selecting the solder paste, users can either use the profile as is or can modify the specifications to create a process window that meets their own unique criteria.
2. Link Your Product to the Process Window
Once the Process Window is selected (defined), the next step in using Auto-Focus is selecting the product to be soldered (or assigning a name if the product has not yet been defined). This step, in effect, links the product to the selected process window. It also links the process window and the product to the CR Series Oven data in the database. The oven data has been produced by KIC's characterization of the unique thermal properties of specific CR Series oven models as they relate to varying product sizes and processes.
3. Define the Product's Physical Characteristics
The user now enters the average length, average width, and total weight of the product.
4. Obtain and Confirm the Oven Settings
Auto-Focus now scans the built-in database for zone temperature/belt speed settings that produce a thermal profile that best fits within the process window when soldering a similarly sized product. By comparing that profile to the desired process window, Auto-Focus is able to estimate the PWI™ (Process Window Index); a single value that will give the user an indication of how far "within spec" the actual profile will be when using the recommended oven settings. If the PWI value is acceptable, the user can then obtain the exact temperature settings for each zone along with the belt speed.

Click here for More Information on AUTO FOCUS

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