Even when metalized circuit boards are processed – such as those populated with heat-generating LEDs that require heat-dissipating metal inner layers – this machine will easily make the cut.
SDM313 also cuts flexible and ultra-thin PCBs (down to 0.5 mm thick) clean, with no ripping or tearing, even when sensitive components such as delicate ceramic capacitors, are mounted within 0.5 mm of the score line. The linear, rather than circular, cutting surfaces allow for faster separations without added stress.
Alignment between the SDM313's linear cutting blades and the panel's score line is achieved using a knob at the top of the machine. The narrow separation between the upper and lower blades (a maximum of 4 mm) protects the operator from the blade edges.
|PCB Thickness||0.5 mm to 1.2 mm (with minimum 0.15 mm scoring depth) |
Up to 2.0 mm (with minimum 0.5 mm scoring depth)
|Maximum Depaneling Length||300 mm (11.8") with 0.5 mm remaining PCB thickness |
200 mm (7.9") with 1.0 mm remaining PCB thickness
|V-Scoring Lines Specs:|| |
|Production Rate||High volume|
|Minimum Component Distance from V-Groove||0.5 mm|
|Maximum Component Height||20 mm|
|PCB Materials||Aluminum, FR4, CEM3, etc.|
|Air Requirement||4 to 6 bar|
|Dimensions (L x W x H)||259 mm x 595 mm x 380 mm |
(10.1" x 23.4" x 14.9")
|Net Weight||140 kg (309 lbs)|
|Shipping Weight||166 kg (366 lbs)|