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The SDM101 is designed for true low-stress depaneling, preventing board damage, solder joint cracks, and component defects—even with components placed as close as 1 mm from the score line.
- Low-stress separation: protects boards, components, and solder joints
- Flexible panel support: handles X or X/Y V-scored panels
- 0.8–3.0 mm PCB thickness: accommodates a wide range of boards
- Angled processing table: allows boards to fall away after cutting
- No power or air required: zero utility cost and portable use
- Safety shield: shatterproof Plexiglas protects the operator
With its heavy-duty construction and low-maintenance design, the SDM101 offers a reliable, flexible depaneling solution for any production environment.
| SDM101 SPECIFICATIONS | |
|---|---|
| PCB Thickness | 0.8-3.0 mm |
| Max PCB Width | Unlimited |
| Max PCB Length | 17.5" (445 mm) 19" (483 mm) Optional |
| Score Angle | 20˚ |
| Minimum Component Distance to V-Groove |
1 mm |
| Max Component Height | 1.26" (32 mm) |
| PCB Materials | Anything but Aluminum |
| Separating Speed | Operator Dependent |
| Depaneling Mode | Manual |
| Production Volume | Moderate |
| Power | N/A |
| Dimensions | 29.5" x 9.4" x 18.4" (750 x 240 x 742 mm) Process Table: 19.7" x 6.5" (500 x 165 mm) |
| Net Weight | Standard Size with 445 mm Cut Length: 70.5 lbs (32 kg) Large Size with 483 mm Cut Length: 88 lbs (40 kg) |
| Shipping Weight | Standard Size with 445 mm Cut Length: 146 lbs (66 kg) Large Size with 483 mm Cut Length: 163 lbs (74 kg) |
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