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Compact, High-Performance Reflow for Mid- to High-Volume Production
The CR8000 is an 8-zone reflow oven designed for precise, high-temperature lead-free and leaded SMT production, delivering high throughput in a space-efficient footprint.
- 8-zone reflow system: supports demanding thermal profiles
- 20–30% shorter design: saves floor space vs comparable ovens
- High thermal efficiency: combines high-mass heating with optimized heat transfer
- Cost-effective performance: delivers high throughput at a lower price point
This compact design provides uniform heating and exceptional process stability, ensuring consistent results even under varying production loads.
Precision Thermal Control and Real-Time Profiling
The CR8000 delivers precise thermal control with ±1°C accuracy and a ΔT of ±2°C, ensuring consistent, repeatable reflow results.
- ±1°C temperature accuracy: stable control across all heating zones
- ΔT ±2°C: uniform heating across PCB assemblies
- Low-turbulence airflow: prevents component shifting during reflow
- High-speed convection: maximizes heat transfer and process stability
Integrated thermocouple inputs and profiling software enable real-time temperature measurement and process verification, while advanced PID control with PLC and SSR systems ensures stable, repeatable thermal performance.
For more advanced profile prediction, KIC Auto-Focus Power software is available.
Flexible, High-Precision Conveyor System
The CR8000 features a combination conveyor system designed for flexible board handling and stable transport, supporting PCBs up to 17" (430 mm) wide.
- 22" (570 mm) mesh belt: stainless steel construction for durability
- Edge pin conveyor: adjustable rails for flexible PCB support
- Inline and double-sided processing: supports automated workflows
- Programmable speeds: 400–1800 mm/min for process control
All conveyor components are constructed from high-strength stainless steel to maintain dimensional accuracy at lead-free temperatures, while automatic chain lubrication and motorized width adjustment ensure reliable, distortion-free PCB transport.
Advanced Water-Chilled Cooling for Lead-Free Reflow
The CR8000 uses internal water-chilled recirculating cooling to deliver precise and efficient cooling for lead-free soldering processes.
- Water-chilled cooling system: more effective than air-only cooling
- Controlled cooling rates: reduces peak temperature exposure
- Improved process control: aligns with solder paste specifications
- Protects sensitive components: minimizes thermal stress
This controlled cooling approach improves repeatability and helps protect components operating near thermal limits in lead-free applications.
High-Efficiency Flux Filtration and Reclaiming
The CR8000 includes a built-in flux filtration and reclaiming system that maintains a clean oven environment and supports long-term stability.
- Integrated filtration system: captures flux residues during operation
- Reduced contamination: keeps the oven tunnel clean
- Extended service intervals: lowers maintenance requirements
- Improved airflow stability: supports consistent thermal performance
Efficient flux management improves reliability, simplifies maintenance, and helps maintain consistent reflow performance over time.
Advanced Oven Control Software and System Safety
The CR8000 uses Windows 11-based control software to provide full system visibility and precise process control during production.
- Graphical user interface: displays real-time temperatures, speeds, and system status
- Unlimited recipe storage: save and recall process settings
- Automated scheduling: timed startup, shutdown, and weekly programming
- Alarms and protection: visual and audible alerts with secure access controls
The system includes a 15" monitor, keyboard, and trackball, along with networking capability, built-in PCB profiling, and UPS battery backup to safely convey boards during power interruptions.
| CR8000 Specifications | |
|---|---|
| # of Zones | 8 Upper, 8 Lower |
| Heating Mode | Hot Air Forced Convection |
| Heated Tunnel Length | 106" (2700 mm) |
| Temp Control | PID (Proportional-Integral-Differential) & SSR |
| Temperature Range | Ambient - 300°C |
| Precision of Temp Control | ±1° C |
| Delta T | ±2° C |
| Cooling Zones | 2 |
| Cooling Method | Wind Cooling System |
| On-Board Profiling with 3 Thermocouple Inputs | Yes |
| Ramp Up Time | ~35 min |
| Flux Management System | Yes |
| Mesh Belt Width | 22.4" (570 mm) |
| Pin Conveyor Width | 1.97"-17.7" (50-450 mm) |
| Max Component Height Upper | 30 mm (Above Pins) |
| Max Component Height Lower | 25 mm |
| Conveyor Speed | 0.4-1.8M/min |
| Conveyor Direction | Left-Right |
| Conveyor Height | 900 mm ±20 mm |
| Operating System | Windows 10 |
| Automatic Chain Lubrication | Yes |
| Power Requirement | 220 V 3-Phase, 197A, 60Hz |
| Power Consumption | 10-14 Kw |
| Total Power | 60 Kw |
| Compressed Air Supply | 80 psi |
| # of Exhaust Ports | 3 |
| Exhaust Opening Size | 8" |
| Total Exhaust Venting | 1200CFM (400CFM Per Port) |
| Hood Opening Mechanism | Electric Raise and Lower |
| Net Weight | 4400 lbs (2000 kg) |
| Machine Dimension | 189" L x 60" W x 61" H (4800 x 1510 x 1550 mm) |
| UPS for Conveyor and PC | Yes |
| Shipping Dimension | 205" L x 71" W x 77" H (5200 x 1850 x 1950 mm) |
| Shipping Weight | 4916 lbs (2230 kg) |
| CE Compliance | Yes |
| Options | |
| Nitrogen Atmosphere Compatible | Yes |
| Infra-red (IR) | Yes |
| Central Support | Yes |
| SMEMA Compatible | Yes |
| Wider Pin and Mesh Conveyor | 17.7" (450 mm) |
| Internal Chilled Water Cooling | Yes |
| Exterior Chiller | Yes |
How 'Auto Focus Power' Profile Prediction Works:
1. Select Your Solder Paste Formula and Process Window
The KIC Auto-Focus Power software includes a database of over 1000 different solder paste formulas from dozens of different solder paste manufacturers. Each database entry includes the manufacturer's recommended solder profile for that specific solder paste formula and identifies critical specifications (i.e. maximum ramp rate, maximum cooling rate, temperatures for preheat, soak, reflow, and peak, allowable times above those temperatures, etc., with upper and lower limits for each) that define the process window. After selecting the solder paste, users can either use the profile as is or can modify the specifications to create a process window that meets their own unique criteria.
2. Link Your Product to the Process Window
Once the Process Window is selected (defined), the next step in using Auto-Focus is selecting the product to be soldered (or assigning a name if the product has not yet been defined). This step, in effect, links the product to the selected process window. It also links the process window and the product to the CR Series Oven data in the database. The oven data has been produced by KIC's characterization of the unique thermal properties of specific CR Series oven models as they relate to varying product sizes and processes.
3. Define the Product's Physical Characteristics
The user now enters the average length, average width, and total weight of the product.
4. Obtain and Confirm the Oven Settings
Auto-Focus now scans the built-in database for zone temperature/belt speed settings that produce a thermal profile that best fits within the process window when soldering a similarly sized product. By comparing that profile to the desired process window, Auto-Focus is able to estimate the PWI™ (Process Window Index); a single value that will give the user an indication of how far "within spec" the actual profile will be when using the recommended oven settings. If the PWI value is acceptable, the user can then obtain the exact temperature settings for each zone along with the belt speed.
