CR6000 6-Zone SMT Reflow Oven

CR6000 6-Zone SMT Reflow Oven

High-performance 6-zone reflow oven for precise SMT production.

The CR6000 is a 6-zone forced hot air convection reflow oven designed to deliver consistent results with efficient thermal transfer and high throughput, even with a shorter heating tunnel.

  • 6-zone convection system: independently controlled upper and lower heating
  • Up to 300°C: supports leaded and lead-free processes
  • Uniform thermal control: ensures reliable, repeatable reflow
  • Pin-over-mesh conveyor: handles a wide range of PCB sizes

The CR6000 combines efficient heating and precise control to deliver consistent, high-quality reflow performance.

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Questions? Reach Out Directly:

Chris Ellis - East Coast

Sales & Operations Manager

215.869.8374

Ed Stone - West Coast

Sales Manager

215.808.6266

Compact, Cost-Effective Lead and Lead-Free Reflow Solution

The CR6000 is a 6-zone reflow oven designed for leaded and lead-free SMT production, delivering consistent results while reducing space and cost requirements.

  • 6-zone reflow system: supports precise thermal control for demanding processes
  • 20–30% shorter design: saves floor space compared to similar systems
  • Lead-free capable: handles higher temperatures and tighter process windows
  • Efficient thermal design: combines high-mass heating with optimized heat transfer

This compact design maintains uniform heating and process stability, ensuring consistent reflow performance across varying production loads.

Precision Temperature Control and Advanced Thermal Profiling

The CR6000 delivers precise thermal control with ±1°C accuracy and a ΔT of ±2°C, ensuring consistent, repeatable reflow results for both leaded and lead-free processes.

  • ±1°C temperature accuracy: stable control across all heating zones
  • ΔT ±2°C: uniform heating across the entire PCB
  • High-speed convection: maximizes heat transfer and process stability
  • Low-turbulence airflow: prevents component shift during reflow

Integrated profiling software with included thermocouples enables real-time measurement and process verification, ensuring compliance with solder paste requirements and consistent production results.

Flexible, High-Precision Conveyor System

The CR6000 features a combination conveyor system designed for flexible board handling and stable transport, supporting PCBs up to 17" (430 mm) wide.

  • 22" (570 mm) mesh belt: stainless steel construction for durability
  • Edge pin conveyor: adjustable rails for flexible PCB support
  • Programmable speeds: 400–1800 mm/min for process control
  • Three-point rail adjustment: ensures stable, distortion-free transport

High-strength stainless steel components maintain dimensional stability at lead-free temperatures, while automatic chain lubrication ensures reliable, long-term operation.

Advanced Oven Control Software and System Safety

The CR6000 uses Windows 11-based control software to provide full process visibility and precise system control during production.

  • Graphical user interface: displays real-time temperatures, speeds, and system status
  • Unlimited recipe storage: save and recall process settings
  • Automated scheduling: timed startup, shutdown, and weekly programming
  • Alarms and protection: visual and audible alerts with secure access controls

The system includes a 15" monitor, keyboard, and trackball, along with built-in PCB profiling, networking capability, and UPS backup to safely handle power interruptions.

Safety, Monitoring, and Expandability

The CR6000 is designed for safe, reliable operation with built-in monitoring and future expansion capabilities.

  • Signal light tower: provides clear operational status indication
  • Real-time monitoring: displays system status and alarms
  • Operation logging: supports traceability and process tracking
  • UPS backup and shutdown: safely conveys boards during power loss

The system is nitrogen-ready, allowing nitrogen capability to be added later as production requirements evolve.

CR6000 Specifications
# of Zones 6 Upper, 6 Lower
Heating Mode Hot Air Forced Convection
Heated Tunnel Length 81" (2050 mm)
Temp Control PID (Proportional-Integral-Differential) & SSR
Temperature Range Ambient - 300°C
Precision of Temp Control ±1° C
Delta T ±2° C
Cooling Zones 2
Cooling Method Wind Cooling System
On-Board Profiling with 3 Thermocouple Inputs           Yes
Ramp Up Time ~35 min
Flux Management System Yes
Mesh Belt Width 22.4" (570 mm)
Pin Conveyor Width 1.97"-17.7" (50-450 mm)
Max Component Height Upper 30 mm (Above Pins)
Max Component Height Lower 25 mm
Conveyor Speed 0.4-1.8M/min
Conveyor Direction Left-Right
Conveyor Height 900 mm ±20 mm
Operating System Windows 10
Automatic Chain Lubrication Yes
Power Requirement 220 V 3-Phase, 125A, 60Hz
Power Consumption 7.5-10.5 Kw
Total Power 45 Kw
Compressed Air Supply 80 psi
# of Exhaust Ports 3
Exhaust Opening Size 8"
Total Exhaust Venting 1200CFM (400CFM Per Port)
Hood Opening Mechanism Electric Raise and Lower
Net Weight 3740 lbs (1700 kg)
Machine Dimension 163" L x 60" W x 61" H (4150 x 1510 x 1550 mm)
UPS for Conveyor and PC Yes
Shipping Dimension 182" L x 65" W x 74" H (4610 x 1660 x 1880 mm)
Shipping Weight 4341 lbs (1969 kg)
CE Compliance Yes
 
Options
Nitrogen Atmosphere Compatible Yes
Infra-red (IR) Yes
Central Support Yes
SMEMA Compatible Yes
Wider Pin and Mesh Conveyor 17.7" (450 mm)
Internal Chilled Water Cooling Yes
Exterior Chiller Yes

How 'Auto Focus Power' Profile Prediction Works:

1. Select Your Solder Paste Formula and Process Window

The KIC Auto-Focus Power software includes a database of over 1000 different solder paste formulas from dozens of different solder paste manufacturers. Each database entry includes the manufacturer's recommended solder profile for that specific solder paste formula and identifies critical specifications (i.e. maximum ramp rate, maximum cooling rate, temperatures for preheat, soak, reflow, and peak, allowable times above those temperatures, etc., with upper and lower limits for each) that define the process window. After selecting the solder paste, users can either use the profile as is or can modify the specifications to create a process window that meets their own unique criteria.

2. Link Your Product to the Process Window

Once the Process Window is selected (defined), the next step in using Auto-Focus is selecting the product to be soldered (or assigning a name if the product has not yet been defined). This step, in effect, links the product to the selected process window. It also links the process window and the product to the CR Series Oven data in the database. The oven data has been produced by KIC's characterization of the unique thermal properties of specific CR Series oven models as they relate to varying product sizes and processes.

3. Define the Product's Physical Characteristics

The user now enters the average length, average width, and total weight of the product.

4. Obtain and Confirm the Oven Settings

Auto-Focus now scans the built-in database for zone temperature/belt speed settings that produce a thermal profile that best fits within the process window when soldering a similarly sized product. By comparing that profile to the desired process window, Auto-Focus is able to estimate the PWI™ (Process Window Index); a single value that will give the user an indication of how far "within spec" the actual profile will be when using the recommended oven settings. If the PWI value is acceptable, the user can then obtain the exact temperature settings for each zone along with the belt speed.

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