CR5000 5-Zone SMT Reflow Oven

CR5000 5-Zone SMT Reflow Oven

CR5000 5-Zone SMT Reflow Oven

Compact 5-zone reflow oven for precise, high-efficiency SMT production.

The CR5000 is a 5-zone SMT reflow oven designed to deliver consistent, high-quality results for both leaded and lead-free processes. Its compact footprint makes it ideal for mid-volume production environments that require full performance without large system space requirements.

  • 5-zone reflow system: enables precise thermal profiling and process control
  • Low ΔT performance: ensures uniform heating across every board
  • Compact footprint: maximizes floor space efficiency
  • KIC predictive profiling: optimizes temperature accuracy and process setup
  • Consistent throughput: supports reliable, repeatable production

With integrated KIC profiling and stable thermal performance, the CR5000 provides the control, efficiency, and consistency required for demanding SMT assembly applications.

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Questions? Reach Out Directly:

Chris Ellis - East Coast

Sales & Operations Manager

215.869.8374

Ed Stone - West Coast

Sales Manager

215.808.6266

Advanced Conveyor Flexibility and Durability

The CR5000 features a versatile conveyor system designed to support a wide range of PCB sizes and production requirements, with programmable speeds from 400–1800 mm/min (16"–71").

  • 22.4" (570 mm) mesh belt: stainless-steel construction for durability
  • Edge pin conveyor: adjustable rails for flexible board handling
  • Inline capability: supports integration into automated production lines
  • Programmable speeds: 400–1800 mm/min for process control
  • Double-sided support: compatible with complex PCB assemblies

All conveyor components are built from high-strength stainless steel to maintain precise dimensional tolerances at elevated lead-free processing temperatures, ensuring reliable transport and long-term durability.

Independent Upper and Lower PID Temperature Controls

The CR5000 delivers precise thermal control with ±1°C accuracy and a guaranteed ΔT of ±2°C, ensuring consistent and repeatable reflow results.

  • ±1°C temperature accuracy: precise control across all zones
  • ΔT ±2°C: uniform heating across the PCB
  • Independent PID controls: separate upper and lower zone control
  • Low-turbulence airflow: prevents component shifting during reflow

The advanced diffuser design creates stable, low-velocity airflow, maintaining low ΔT and consistent thermal performance even at higher throughput levels.

High-Efficiency Flux Filtration and Reclaiming

The CR5000 includes a built-in flux filtration and reclaiming system that maintains a clean oven environment and supports consistent performance.

  • Integrated filtration system: captures flux residues during operation
  • Reduced contamination: keeps the oven tunnel clean
  • Extended service intervals: lowers maintenance requirements
  • Improved airflow stability: supports consistent thermal performance

Efficient flux management improves long-term reliability, simplifies maintenance, and supports a cleaner, more stable production environment.

Advanced Touchscreen Control and Process Management

The CR5000 uses a full-screen graphical interface to provide real-time visibility into temperature, conveyor speed, and system status for precise process control.

  • Full-screen interface: monitors zone temperatures and system status
  • Unlimited recipe storage: supports repeatable production setups
  • Network-ready system: supports integration and data sharing across production
  • Timed startup and shutdown: automates production scheduling
  • Alarms and password protection: ensures safe and controlled operation

The Windows-based system includes a 15" monitor, keyboard, and trackball, along with a built-in UPS battery backup to safely protect boards during power interruptions.

Precision Temperature Profiling and Process Verification

The CR5000 provides accurate, real-time temperature profiling using thermocouples and predictive software to ensure consistent, repeatable reflow results.

  • Real-time profiling: verifies thermal performance during operation
  • Included thermocouples: measure critical PCB locations
  • 3 thermocouple inputs: supports detailed thermal analysis
  • Predictive profiling software: simplifies process setup and optimization

This profiling capability ensures compliance with solder paste specifications and enables precise process control. For more advanced profiling, KIC Auto-Focus Power software is available.

CR5000 Specifications
# of Zones 5 Upper, 5 Lower
Heating Mode Hot Air Forced Convection
Heated Tunnel Length 75" (1910 mm)
Temp Control PID (Proportional-Integral-Differential) & SSR
Temperature Range Ambient - 300°C
Precision of Temp Control ±1° C
Delta T ±2° C
Cooling Zones 1
Cooling Method Wind Cooling System
On-Board Profiling with 3 Thermocouple Inputs           Yes
Ramp Up Time ~35 min
Flux Management System Yes
Mesh Belt Width 22.4" (570 mm)
Pin Conveyor Width 1.97"-17.7" (50-450 mm)
Max Component Height Upper 30 mm (Above Pins)
Max Component Height Lower 25 mm
Conveyor Speed 0.4-1.8M/min
Conveyor Direction Left-Right
Conveyor Height 900 mm ±20 mm
Operating System Windows 10
Automatic Chain Lubrication Yes
Power Requirement 220 V 3-Phase, 100A, 60Hz
Power Consumption 6.5-10 Kw
Total Power 38 Kw
Compressed Air Supply 80 psi
# of Exhaust Ports 2
Exhaust Opening Size 8"
Total Exhaust Venting 800CFM (400CFM Per Port)
Hood Opening Mechanism Electric Raise and Lower
Net Weight 2640 lbs (1200 kg)
Machine Dimension 120" L x 55" W x 57" H (3040 x 1380 x 1445 mm)
UPS for Conveyor and PC Yes
Shipping Dimension 132" L x 65" W x 74" H (3330 x 1660 x 1880 mm)
Shipping Weight 3366 lbs (1530 kg)
CE Compliance Yes
 
Options
Nitrogen Atmosphere Compatible Yes
Infra-red (IR) Yes
Central Support Yes
SMEMA Compatible Yes
Wider Pin and Mesh Conveyor 17.7" (450 mm)
Internal Chilled Water Cooling No
Exterior Chiller No

How 'Auto Focus Power' Profile Prediction Works:

1. Select Your Solder Paste Formula and Process Window

The KIC Auto-Focus Power software includes a database of over 1000 different solder paste formulas from dozens of different solder paste manufacturers. Each database entry includes the manufacturer's recommended solder profile for that specific solder paste formula and identifies critical specifications (i.e. maximum ramp rate, maximum cooling rate, temperatures for preheat, soak, reflow, and peak, allowable times above those temperatures, etc., with upper and lower limits for each) that define the process window. After selecting the solder paste, users can either use the profile as is or can modify the specifications to create a process window that meets their own unique criteria.

2. Link Your Product to the Process Window

Once the Process Window is selected (defined), the next step in using Auto-Focus is selecting the product to be soldered (or assigning a name if the product has not yet been defined). This step, in effect, links the product to the selected process window. It also links the process window and the product to the CR Series Oven data in the database. The oven data has been produced by KIC's characterization of the unique thermal properties of specific CR Series oven models as they relate to varying product sizes and processes.

3. Define the Product's Physical Characteristics

The user now enters the average length, average width, and total weight of the product.

4. Obtain and Confirm the Oven Settings

Auto-Focus now scans the built-in database for zone temperature/belt speed settings that produce a thermal profile that best fits within the process window when soldering a similarly sized product. By comparing that profile to the desired process window, Auto-Focus is able to estimate the PWI™ (Process Window Index); a single value that will give the user an indication of how far "within spec" the actual profile will be when using the recommended oven settings. If the PWI value is acceptable, the user can then obtain the exact temperature settings for each zone along with the belt speed.

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