ULTIMA NEO-L All-in-One Selective Soldering System

ULTIMA NEO-L All-in-One Selective Soldering System
ULTIMA NEO-L All-in-One Selective Soldering System
ULTIMA NEO-L All-in-One Selective Soldering System
Carriage with board
ULTIMA NEO-L All-in-One Selective Soldering System
ULTIMA NEO-L All-in-One Selective Soldering System
ULTIMA NEO-L All-in-One Selective Soldering System
ULTIMA NEO-L All-in-One Selective Soldering System
Carriage without board
ULTIMA NEO-L All-in-One Selective Soldering System
Flux Container
ULTIMA NEO-L All-in-One Selective Soldering System
Attaching Nozzle
ULTIMA NEO-L All-in-One Selective Soldering System
Nozzle Attached
ULTIMA NEO-L All-in-One Selective Soldering System
Nozzle Loosening
ULTIMA NEO-L All-in-One Selective Soldering System
Pot with Cover
ULTIMA NEO-L All-in-One Selective Soldering System
Solder Pot Removal
ULTIMA NEO-L All-in-One Selective Soldering System
ULTIMA NEO-L All-in-One Selective Soldering System
Pressure Panel
ULTIMA NEO-L All-in-One Selective Soldering System
Shipping Blocks
ULTIMA NEO-L All-in-One Selective Soldering System
Shipping Posts
ULTIMA NEO-L All-in-One Selective Soldering System
Machine with all covers on
ULTIMA NEO-L All-in-One Selective Soldering System
ULTIMA NEO-L All-in-One Selective Soldering System
ULTIMA NEO-L All-in-One Selective Soldering System
ULTIMA NEO-L All-in-One Selective Soldering System
ULTIMA NEO-L All-in-One Selective Soldering System
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ULTIMA NEO-L All-in-One Selective Soldering System

ULTIMA NEO-L All-in-One Selective Soldering System

Compact selective soldering with integrated fluxing for consistent, repeatable results.

The ULTIMA NEO-L combines high-precision selective fluxing with fully programmable point-to-point and linear soldering in a space-saving design.

  • Full XYZ motion control: precise PCB positioning
  • Integrated fluxing + soldering: streamlined process
  • Automated operation: replaces manual soldering

By moving the PCB over a stationary solder pot and flux jet, the system delivers consistent quality while reducing the risk of overheating or board damage—ideal for small to medium production.

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Chris Ellis - East Coast

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Description Protect_msd Restore_and_store Specifications Features Jet_dispenser Feeders Machine_configurations Applications Profile_predictions Performance_charts Video Navigator_software Process_window Add_ons Temperature_tolerance Includes Add_fluxing Machine_options Software_options

Large Board Holder and Precision X-Y-Z Drive Mechanism

The ULTIMA NEO-L features a spacious work envelope with an oversized PCB holder, supporting boards up to 18" x 15" (460 x 380 mm) in a single pass.

A high-precision X-Y-Z motion system moves the PCB over a stationary solder pot, delivering ±0.004" (±0.1 mm) positional accuracy with programmable speeds from slow soldering movements to rapid point-to-point transitions for consistent, repeatable results.

Highly Responsive Solder Pump for Precise Control of Miniature Wave

The NEO-L’s programmable solder pump provides fast, precise control of wave height and solder volume through adjustable speed and acceleration.

An integrated nitrogen micro-heater (up to 400°C) surrounds the nozzle, maintaining stable temperature and reducing oxidation for consistent solder quality.

Solder Connectors with Parallel Rows of Pins in a Single Pass

Multiple rows of connector pins can be soldered in a single pass using larger or custom-shaped nozzles, significantly improving throughput.

Nozzle selection depends on pad size, spacing, and production requirements.

Wide Variety of Quick-Change Nozzles Available

A wide range of precision nozzles (2.5–20 mm) allows the system to adapt to different applications.

Polished stainless steel construction ensures smooth, laminar flow and stable wave performance. Nozzle size determines wave diameter and solder coverage.

Compact Solder Pot Slides In and Out for Easy Maintenance

The compact 16 kg solder pot remains stationary while the PCB moves across the wave, improving process stability.

The module slides out for quick maintenance and easy solder loading. Optional upgrades include a 32 kg pot, low-level alarm, and automatic solder feeder.

View and Record Live Video of Soldering Operations

An optional HD camera with adjustable LED lighting provides real-time visibility of the soldering process, allowing operators to monitor and record operations for quality control and training.

Generate Program Data From PCB Scans or Gerber Data Import

Programs can be created using numeric input, Gerber files, or scanned PCB images.

An intuitive visual editor allows users to define solder paths as points or lines, with programs created offline or online and automatically adapted for selective fluxing.

Wave Simulation Mode Checks Solder Coverage Area

Wave simulation mode allows users to verify solder coverage based on selected nozzle size before production, helping prevent setup errors.

Editable Parameters for Complete Control of All Soldering Functions

The NEO-L software provides full control over soldering parameters, including Z-axis height, dwell time, XY speed, and pump flow.

These settings ensure repeatable results while minimizing defects such as bridging and icicling. Program timing is automatically calculated for efficient planning.

Easy Import and Conversion of Gerber Data Into Soldering Programs

Imported Gerber data is automatically converted into an interactive PCB layout, allowing users to quickly select pads and define solder paths as points or continuous lines.

High-Precision Spray Fluxing

The precision spray nozzle delivers controlled round or linear spray patterns using minimal flux, reducing consumable costs.

Independent pressure controls ensure accurate regulation of spray volume and density for consistent application.

Selective Fluxing Programs Automatically Generated From Soldering Data

Soldering programs are automatically converted into corresponding selective fluxing programs, streamlining setup and ensuring process consistency.

PCB HOLDER AND X-, Y-, Z-AXIS DRIVE MECHANISM
Maximum PCB Size 380 mm x 460 mm (15" x 18")
Minimum PCB Size 50 mm x 50 mm (2" x 2")
PCB Thickness 0.8 mm - 2.0 mm (0.032" - 0.080")
PCB Warp 0.5 mm (0.020") maximum
Maximum PCB Weight 2 kg (4.4 lbs.) including components;
4 kg (8.8 lbs.) capacity optional
Component Lead Length 3 mm (0.12") recommended maximum
Component Height (Top Side) 50 mm (2") maximum above PCB top side
Component Height (Bottom Side) Soldering path programmable to avoid components and assemblies mounted on bottom side. Click here for diagram with maximum and minimum dimensions.
PCB Edge Clearance 3 mm (0.12") for components
5 mm (0.20") for solder pad edge
Positional Accuracy ±0.1 mm (±0.004")
X-Axis Resolution 0.032mm (0.0013")
Y-Axis Resolution 0.033 mm (0.0013")
Z-Axis Resolution 0.008 mm (0.0003") 50cm2/sec
Travel Speed (While Soldering) Programmable from 0.1 mm/sec - 10.0 mm/sec (0.004"/sec - 0.4"/sec)
Travel Speed (Between Points) 400 mm/sec (15.75"/sec) maximum
NITROGEN PREHEATER
Heating Method Micro Heater and Temperature Sensor Integrated with Nozzle Hood
Temperature Range Ambient to 400°C (Inside Nozzle Hood)
Heater Power 1.3 KW x 1 pc.
Nitrogen Consumption 25 liters/min
Nitrogen Flow Control Digital Flowmeter and Pressure Regulator
SOLDER WAVE AND BATH
Solder Types Both Lead-Free and Conventional Sn/Pb Solders;
Second Separate Solder Pot Recommended When Using Both Types
Wave Diameter Nozzle Dependent Based on Inner Diameter
(2.5, 3.0, 4.0, 5.0, 6.0, 7.0, 8.0, 9.0, 10.0, 12.0, 14.0, 16.0, 20.0 mm Inner Diameter Nozzles Available)
Solder Wave Height 4 mm (0.16") maximum
Solder Wave Height Adjustment Controlled by Pump Motor RPM
Solder Wave Height Accuracy ±0.3 mm (±0.012")
Solder Capacity Approx. 16 kg (35 lbs.)
Solder Melting Method Indirect Heating with Cartridge Heaters
Solder Temperature Ambient to 300°C
Solder Melt Time at Startup Approx. 30 min.
CONTROLLER
Program Storage Internal Memory for 1000 Steps Per File, Number of Files Determined by Hard Disc Drive
User Interface Push-Button Controls and 15" Touch Screen Display
UTILITIES/FACILITIES REQUIREMENTS
Machine Dimensions 1575 mm L x 1067 mm W x 1194 mm H (62" x 42" x 47")
Machine Weight 400kg (880lbs)
Power Source 200-220 VAC, Single Phase, 50/60 Hz, 4 KVA
Nitrogen Supply 0.4 - 0.5 MPa (60-75 psi); 25 l/min (0.9 CFM)
Compressed Air 70 psi, 1.7 CFM

ULTIMA NEO-L Features

  • Eliminates time-consuming hand soldering operations and expensive wave soldering fixtures
  • Reduces risk of component overheating and PCB damage
  • High-precision X-Y-Z-axis drive moves the PCB over the stationary solder pot and flux jet, allowing for a compact design in a standalone machine
  • Flexible PCB holder with quick-release cam-locks enables fast loading and unloading of boards up to 380 x 460 mm (15" x 18")
  • Integral wave nozzle hood with built-in micro-preheater (controllable to 400 °C) shrouds soldering site with inert nitrogen and prevents oxidation
  • Bottom-side witness camera option provides real-time video inspection of the soldering process
  • Fully programmable point-to-point or continuous linear soldering
  • Variable solder pump speed and wave height control
  • Wide variety of dip height and dwell parameter settings
  • Built-in PC controller and Windows™-based software for on-line or off-line programming and unlimited program storage
  • Optional software for fast program generation via Gerber data import or scanned PCB image
  • Nozzle diameters from 2.5 mm to 20 mm (0.1" to 0.79")
  • Designed for both lead-free and conventional Sn/Pb solders
  • High-precision, pressurized air atomization nozzle for programmable selective fluxing
  • Utilizes selective soldering coordinate data to automatically generate selective fluxing operation
  • Built-in flux reservoir with hi-level/low-level alarms
  • Integral, 97 mm diameter (4") port for connection to factory exhaust
More from Selective Soldering
ULTIMA TRZ Benchtop Selective Soldering Machine
  • PCBs to 330 x 250 mm
  • No PC Included
  • Optional External Spray Fluxer Machine