Compact Design for Labs, Prototyping, and Small-Scale Production

The MC302N is designed for labs, schools, prototyping, and small-scale SMT production, delivering advanced reflow capability in a compact benchtop system.

• Compact footprint: 789 × 742 × 483 mm (31" × 29" × 19")
• Benchtop installation: fits easily in space-constrained environments
• 320 × 220 mm soldering area: supports a wide range of PCB sizes
• Viewing window: monitor the soldering process in real time

The system simulates full inline reflow profiles—including preheat, soak, reflow, and cooling—making it ideal for development, testing, and manufacturability validation.

Full Hot-Air Convection with Nitrogen Capability

The MC302N combines full hot air convection heating with integrated nitrogen capability to deliver consistent thermal performance and improved soldering quality.

• Full convection heating: even heat distribution across the PCB
• No shadow effects: consistent heating on complex assemblies
• Nitrogen atmosphere: reduces oxidation during reflow
• Improved solder quality: better wettability and fewer defects

The nitrogen environment helps protect sensitive components and ensures cleaner, more reliable solder joints, especially for fine-pitch applications.

Advanced Touch Control and Profile Management

The MC302N features a dual-core CPU control system with a 7" touchscreen interface for precise and intuitive process control.

• 7" touch interface: easy setup with virtual keyboard
• Full profile control: preheat, soak, reflow, and cooling stages
• Dwell control: define time at melting and peak temperatures
• Automatic rate calculation: verifies heating and cooling profiles

Real-time temperature profiles are displayed during operation, allowing direct comparison between set and actual values for precise tuning.

Profiles and process data can be saved or printed via WiFi for training, development, quality control, and traceability.

Real-Time Dynamic Thermal Control

The MC302N offers real-time dynamic process control based on direct temperature measurement from the PCB surface.

• Real-time feedback: adjusts heat and fan speed automatically
• On-board measurement system: monitors actual PCB temperature
• No offset control: heater output matches measured product temperature
• High accuracy: ideal for prototyping and small production runs

This dynamic system ensures precise thermal performance by responding directly to actual product temperature during the reflow cycle.

Simulated Multi-Zone Temperature Profiling

The MC302N simulates multi-zone reflow oven behavior using programmable temperature and time settings.

• Up to 9 programmable points: create detailed thermal profiles
• Multi-zone simulation: replicates inline oven performance
• Flexible profile creation: supports a wide range of soldering processes

This capability allows users to replicate complex multi-zone reflow profiles in a compact benchtop system.