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Advanced Dual-Head Sorting System
This high-performance system ensures precise, reliable placement of dies, chips, and components.
- Dual-head design: faster, efficient operation
- Vision alignment: accurate positioning
- Pressure control: protects delicate components
- Flexible sequencing: matrix, row, or column placement
Flexible High-Precision Sorting
Designed for versatility, the system supports a wide range of wafer, die, and component sizes.
- Wafer sizes: up to 8" (optional 12")
- Die sizes: 0.8 × 0.8 mm to 15 × 15 mm (up to 20 × 20 mm optional)
- Component sizes: 1 × 1 mm to 20 × 20 mm
- Thickness range: 0.6 mm to 5 mm
- Linear motor system: smooth, high-precision motion
| PH-2 Die & Chip Sorting Machine Specifications | |
|---|---|
| XY Placement Accuracy | ± 0.03 mm |
| XY Resolution | 0.001 mm (@Pulse) |
| Productivity | Max. 3000 uph |
| Flange Loading | Manual loading (direction recognition with auto-tuning) |
| For Wafer (flange) | 4" / 5" / 6" 8" Wafer (flange diam. 290 mm ±2 mm) (12" Wafer is an option) |
| Material of Flange | Steel or Plastic |
| Available Area of Dies Pick-Up | Max. 200 mm x 200 mm (Matrix of Wafer dies) |
| Heads | Placement heads x 2 sets + vision alignment system |
| Place head pressure sensor | Yes, Torque control method |
| Tray Loading | Manual loading in front of machine (Auto-Tray System is option) |
| Pin Ejection System | Ejection height and speed controled by motorized (Ejection heater is option) |
| Placement Platform | Vacuum platform, max. 230 mm x 460 mm |
| Wafer Die Size (mm) | 0.8 x 0.8 mm ~ 15 x 15 mm (20 x 20 mm is option) (Thinness to 0.1 mm) |
| Chips/Component Size | 1x1 ~ 20x20 mm, Thickness: 0.6 ~ 5 mm |
| X/Y Transmission Control | High-precise linear driver |
| Camera | CCD x 3 sets |
| FOV of Camera | FOV 17.5 x 17.5 mm |
| Fiducial Mark Recognition | Marks auto-learning |
| Camera Calibration | System standard with camera centering calibration |
| Placement Sequencing | Matrix, row or column order and direction is optional |
| Coordinate Data Conversion | CAD/Gerber |
| Operation System | Windows 10 |
| Pressure-Air Requirement | 80 psi (5.5 bar) @ 150 L/min |
| Power Supply Requirement | 200VAC ± 10%, 50~60 Hz, 2.5kW |
| Dimensions (L x W x H) | 1300 x 1100 x 1800 mm (without FFU) |
| Weight | Approx. 1100 kg |
