HPX1S Die Attach Machine

Die Attach / Die Bonder Machine HPX1S from Manncorp
Bring Your Die Bonding In House with the HPX1S
HPX1S Die Attach Machine
HPX1S Die Attach Machine
HPX1S Die Attach Machine
HPX1S Die Attach Machine
HPX1S Die Attach Machine
HPX1S Die Attach Machine - Nozzle Changer
HPX1S Die Attach Machine - Wafer Handler
HPX1S Die Attach Machine - Feeder Base

HPX1S Die Attach Machine

Produce high-quality semiconductor chips in your manufacturing facility with our HPX1S Die Attach Machine. This die bonding machine is great for high-accuracy, low-volume, die attach manufacturing needs. Customization options are also available for unique applications. It is equipped with 3 sets of CCD cameras and a bottom camera to help with component alignment. Easily and accurately handle die sizes from 1.4 x 1.4 mm to 7 x 7 mm.

This item ships by freight. If you purchase it through our online store, our sales team will send you a quote for the freight costs after purchase.

Regular price $149,995.00
Chris Ellis  215-869-8374 | East Coast
Ed Stone 215-808-6266 | West Coast

Highly Accurate and Stable

With an XY repeatability of ± 1.5μm and an XY placement accuracy of ± 25μm, this is a highly precise die attach machine that can be trusted to help your company produce high-quality semiconductor chips. The 8" magnetic waffle frame allows the machine to pick die attach components from size 1.4 x 1.4 mm to 7 x 7 mm.

Great for Low Volume, Prototype, and Custom Applications 

The high level of accuracy performed by this die attach machine makes it a perfect solution for prototyping, lab settings, low-volume assembly, on-demand production, and custom applications.

Easy Programming

The software on this equipment is Windows 7, ensuring a short learning curve for operators. Different methods are available for programming, tailoring the machine to your needs with Teach-In and Matrix Data Input systems.

HPX1S Die Attach Specifications
XY Repeatability± 1.5μm
XY Placement Accuracy± 25μm
R Rotation Accuracy±0.3°
PCB HoldingVacuum with Sensor
Working Table Areamax 9.84" x 9.84" (250 x 250 mm)
Wafer Frame Size8" (Outer Dimension 296mm)
Component Size1.4 x 1.4 mm – 7 x 7 mm
Camera SystemCCD x 3 Sets
Camera Resolution1.3 M & 3 M
Component Alignment Digital Bottom Camera
Production Rate1100 UPH
Storage120GB SSD and 1TB HDD Back up
Air Requirement80 psi (5.5bar) @ 150 Liter/min.
Grip Ring HandlerFor Wafer Ring
EjectorPin Ejector
Power Requirement200-230 VAC, 50-60Hz, 1.5kW
Dimensions (LxWxH) 35.8” x 59” x 71.6” (910 x 1500 x 1820 mm)

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MAS399 Pro Micro Assembly & Placement System
  • Wafer, Tape, Tray & Bulk Feeding
  • Accuracy: ± 10μm
  • Placement Area: 600 x 500 mm