MC302 Benchtop Convection Reflow Oven

MC302 Benchtop Convection Reflow Oven
MC302 Benchtop Convection Reflow Oven

MC302 Benchtop Convection Reflow Oven

The MC302 Benchtop Convection Reflow Oven is equipped with a dynamic thermal profile on an Android operating system. By simulating the conditions of an inline reflow system in a benchtop unit, the MC302 is ideal for product development, prototyping, small series production and manufacturability testing. Detailed solder profiles are easily programmed, stored, and downloaded through the MC302's exclusive hardware control app and Quik Smart Profile Programming System. This compact design is ideal for labs, schools, prototyping and low-volume production shops.

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Regular price $13,995.00
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QUESTIONS? TEXT OR CALL:
Chris Ellis  215-869-8374 | East Coast
Ed Stone 215-808-6266 | West Coast

Design Ideal for Labs and Small-Scale Production

Measuring only 770 mm L x 700 mm W x 480 mm H and weighing under 125 kg, the MC302 easily installs on virtually any benchtop. Its ability to simulate inline reflow profiles with preheat, soak, reflow, and cooling phases makes it a great choice for labs or other installations where space is often at a premium. The front-loading heating chamber has an effective soldering area of 320 mm x 220 mm and includes a window for viewing of the soldering process.

Full Hot-Air Soldering Processing

The new generation MC302 Benchtop Convection Reflow Oven is equipped with a full hot air convection system. Hot air is spread evenly to every corner of the PCB board, avoiding shadow effects and color sensitives to temperature sensing deviation and making the heating efficiency of components consistent.

Exclusive Android-Based Control Application

The MC302 Android-based control app provides an easy-to-use, touch-panel interface with virtual keyboard for setting the temperature and duration of the preheat, soak, reflow, and cooling stages. In the reflow zone, the user can specify the dwell at both the melting and peak temperatures. Based on these settings, the system will also automatically calculate the heating or cooling rate in each stage for verification with solder paste and component manufacturers' specifications. In addition, when heater control is based on the higher temperature measured at the heaters, the system displays the calculated board temperature based on a calibrated offset.

Real-Time Dynamic Thermal Control Via On-Board Measuring

The MC302 Benchtop Convection Reflow Oven has an advanced setting in which you can turn on the real-time dynamic process. The unit can then adjust via real-time feedback from the measuring system which is attached at a strategic location on the PCB surface. The heater control and fan speed are based on the actual temperature measured on the product. The target temperature is equal to the dynamic measuring system temperature and there is no offset, making this a perfect tool for prototyping and small series.

Simulated Multi-Zone Temperature and Time Setting

The MC302 series oven is available to set up the dynamic curve by a maximum of 9 points of temperature and timing simulated to the heating process of a multi-zone reflow oven.

MC302 Specifications
Applicable Solder Types Lead-Free and Leaded
Heating Method Full Hot Air Convection
User Interface Android Software Platform 
Ultra High Resolution Touchscreen 
Integrated WiFi & Networking
PCB Holding Size 340 mm x 240 mm
PCB Effective Heating Area 320 mm x 220 mm
Temperature Range Ambient ~280 °C
Temperature Control Method Real-time close loop PID temperature control
for lead free profile
Computer Control Built-in dual core CPU on board computer
Display Panel 7" Touch screen high resolution LCD display
Temperature Control Setting Quick smart profile programming by temperature
rising rate control (degree change per second)
Temperature Profile Display Real-time temperature profile display
Temperature Profile Printing WIFI temperature profile printing
Storage External data storage via WIFI connection
Power 8400W
Voltage 220 V, Single Phase, 50/60 Hz, 35A
Dimensions 770 mm L x 700 mm W x 480 mm H
Weight Approx. 125 kg

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MC301 Benchtop Batch Reflow Oven
  • Soldering Area: 250 mm x 200 mm
  • Preheat, Soak, Reflow, & Cooling
  • Size: 29.2” L x 23.75” W x 12.5” H
$7,495.00
MC302N Benchtop Convection Reflow Oven w/ Nitrogen
  • Soldering Area: 320 mm x 220 mm
  • Nitrogen-Compatible Version
  • Size: 770 mm L x 700 mm W x 480 mm H
$15,995.00