Solder inspection results from the Solder Paste Inspection (SPI) machine can be collected and statistically analyzed, allowing the system to send operating instructions or print-position correction values back to the printer. All statistical processing is performed according to each board's printing direction, ensuring consistent and reliable solder paste quality throughout production.
Description
Protect_msd
Restore_and_store
Specifications
Features
Feeders
Machine_configurations
Applications
Profile_predictions
Performance_charts
Video
Navigator_software
Process_window
Add_ons
Temperature_tolerance
Includes
Add_fluxing
Machine_options
Software_options
Contact
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