Compact Design for Labs, Prototyping, and Small-Scale Production

The MC302 is designed for labs, schools, prototyping, and small-scale SMT production, offering full reflow capability in a compact benchtop system.

• Compact footprint: 789 × 742 × 483 mm (31" × 29" × 19")
• Benchtop installation: fits easily in space-constrained environments
• 320 × 220 mm soldering area: supports a wide range of PCB sizes
• Viewing window: monitor the soldering process in real time

The system simulates full inline reflow profiles—including preheat, soak, reflow, and cooling—making it ideal for development and testing environments.

Full Hot-Air Convection Soldering

The MC302 uses a full hot air convection system to ensure uniform heating across the entire PCB.

• Even heat distribution: consistent temperatures across all components
• No shadow effects: eliminates uneven heating on complex boards
• Improved accuracy: reduces temperature sensing deviations
• Consistent results: reliable soldering across all component types

This convection-based design ensures consistent heating performance, even on densely populated or complex PCB assemblies.

Advanced Touch Control and Profile Management

The MC302 features a dual-core CPU control system with a 7" touchscreen interface for precise and intuitive process control.

• 7" touch interface: easy setup with virtual keyboard input
• Full profile control: set preheat, soak, reflow, and cooling stages
• Dwell control: define time at melting and peak temperatures
• Automatic rate calculation: verifies heating and cooling profiles

Real-time temperature profiles are displayed during operation, allowing direct comparison between set and actual values for precise tuning and validation.

Profiles and process data can be saved or printed via WiFi for training, development, and quality control.

Real-Time Dynamic Thermal Control

The MC302 offers real-time dynamic process control based on direct temperature measurement from the PCB surface.

• Real-time feedback: adjusts heat and fan speed automatically
• On-board measurement system: monitors actual PCB temperature
• No offset control: heater output matches measured product temperature
• High accuracy: ideal for prototyping and small production runs

This dynamic control system ensures precise thermal performance by responding directly to the actual product temperature during the reflow process.

Simulated Multi-Zone Temperature Profiling

The MC302 simulates multi-zone reflow oven behavior using programmable temperature and time settings.

• Up to 9 programmable points: create detailed thermal profiles
• Multi-zone simulation: replicates inline oven performance
• Flexible profile creation: supports a wide range of soldering processes

This capability allows users to replicate complex multi-zone reflow profiles in a compact benchtop system.