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All Products In Category:  ULTIMA NEO-L

ULTIMA NEO-L All-in-One Selective Soldering System

High-precision post-reflow selective soldering and fluxing

The ULTIMA NEO-L combines high-precision selective flux application with fully programmable point-to-point or continuous-linear soldering to solder through-hole components and connectors to SMT boards with complete accuracy and reliability.

Quick Contact — TEXT or CALL:

Chris — East Coast: 215.869.8374

Ed — West Coast: 215.808.6266

ULTIMA NEO-L selective soldering machine



ULTIMA NEO-L - General Specifications
PCB Holder and X-, Y-, Z-Axis Drive Mechanism
Maximum PCB Size 380 mm x 460 mm (15" x 18")
Minimum PCB Size 50 mm x 50 mm (2" x 2")
PCB Thickness 0.8 mm - 2.0 mm (.032" - .080")
PCB Warp 0.5 mm (0.020") maximum
Maximum PCB Weight 2 kg (4.4 lbs.) including components;
4 kg (8.8 lbs.) capacity optional
Component Lead Length 3 mm (0.12") recommended maximum
Component Height (Top Side) 50 mm (2") maximum above PCB top side
Component Height (Bottom Side) Soldering path programmable to avoid components and assemblies mounted on bottom side. Click here for diagram with maximum and minimum dimensions.
PCB Edge Clearance 3 mm (0.12") for components;
5 mm (0.20") for solder pad edge
Positional Accuracy ±0.1 mm (±0.004")
X-Axis Resolution 0.032 mm (0.0013")
Y-Axis Resolution 0.033 mm (0.0013")
Z-Axis Resolution 0.008 mm (0.0003") 50cm2/sec
Travel Speed (While Soldering) Programmable from 0.1 mm/sec - 10.0 mm/sec
(0.004"/sec - 0.4"/sec)
Travel Speed (Between Points) 400 mm/sec (15.75"/sec) maximum
Nitrogen Preheater
Heating Method Micro Heater and Temperature Sensor Integrated with Nozzle Hood
Temperature Range Ambient to 400 °C (Inside Nozzle Hood)
Heater Power 1.3 KW x 1 pc.
Nitrogen Consumption 25 liters/min
Nitrogen Flow Control Digital Flowmeter and Pressure Regulator
Solder Wave and Bath
Solder Types Both Lead-Free and Conventional Sn/Pb Solders; Second Separate Solder Pot Recommended When Using Both Types
Wave Diameter Nozzle Dependent Based on Inner Diameter (2.5, 3.0, 4.0, 5.0, 6.0, 7.0, 8.0, 9.0, 10.0, 12.0, 14.0, 16.0, 20.0 mm Inner Diameter Nozzles Available)
Solder Wave Height 4 mm (0.16") maximum
Solder Wave Height Adjustment Controlled by Pump Motor RPM
Solder Wave Height Accuracy ±0.3 mm (±0.012")
Solder Capacity Approx. 16 kg (35 lbs.)
Solder Melting Method Indirect Heating with Cartridge Heaters
Solder Temperature Ambient to 300 °C
Solder Melt Time at Startup Approx. 30 min.
Program Storage Internal Memory for 1000 Steps Per File, Number of Files Determined by Hard Disc Drive
User Interface Push-Button Controls and 15" Touch Screen Display
Utilities/Facilities Requirements
Machine Dimensions 1050 mm L x 1555 mm W x 1171 mm H
(41.3" x 61.2" x 46.1")
Machine Weight 150 kg (330 lbs.)
Including 16 kg (35 lb.) Solder Capacity
Power Source 208-240 VAC, Single Phase, 50/60 Hz, 4 KVA
Nitrogen Supply 0.4 - 0.5 MPa (60-75 psi); 25 l/min (0.9 CFM)


  • Eliminates time-consuming hand soldering operations and expensive wave soldering fixtures
  • Reduces risk of component overheating and PCB damage
  • High-precision X-Y-Z-axis drive moves the PCB over the stationary solder pot and flux jet, allowing for a compact design in a standalone machine
  • Flexible PCB holder with quick-release cam-locks enables fast loading and unloading of boards up to 380 x 460 mm (15" x 18")
  • Integral wave nozzle hood with built-in micro-preheater (controllable to 400 °C) shrouds soldering site with inert nitrogen and prevents oxidation
  • Bottom-side witness camera option provides real-time video inspection of the soldering process
  • Fully programmable point-to-point or continuous linear soldering
  • Variable solder pump speed and wave height control
  • Wide variety of dip height and dwell parameter settings
  • Built-in PC controller and Windows™-based software for on-line or off-line programming and unlimited program storage
  • Optional software for fast program generation via Gerber data import or scanned PCB image
  • Nozzle diameters from 2.5 mm to 20 mm (0.1" to 0.79")
  • Designed for both lead-free and conventional Sn/Pb solders
  • High-precision, pressurized air atomization nozzle for programmable selective fluxing
  • Utilizes selective soldering coordinate data to automatically generate selective fluxing operation
  • Built-in flux reservoir with hi-level/low-level alarms
  • Integral, 97 mm diameter (4") port for connection to factory exhaust

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