SDM236 LED Depaneler
The SDM236 LED Depaneler has been specially designed to separate extra-long, V-grooved, aluminum panels and thick FR4 PCBs that are often difficult to cut. With PCB support platforms (standard) installed on opposite ends of the depaneler for loading and unloading, the entire system is more than 2.3 meters (91") long and allows more than ample space for handling long 1.2 m (48") substrates commonly used in the manufacture of LED lighting products. The platforms can also accommodate a 370 mm (14.5") panel width for even greater versatility and throughput.
QUESTIONS? TEXT OR CALL
- Chris Ellis 215-869-8374
- EAST COAST
- Ed Stone 215-808-6266
- WEST COAST
FEATURES
The SDM236 has three circular and motorized cutting blades capable of separating v-grooved aluminum boards with an overall thickness from 0.8 mm to 1.6 mm (0.03"-0.06") or FR4 PCBs with an overall thickness from 0.8 mm to 3.0 mm (0.03"-0.12"). Due to its unique design (3 sets of blades and separate cutting stages), the distance between the blades and the progressive depth of each cut can be set independently. In conjunction with a blade speed/cutting speed that is variable from 0-500 mm/s (0-20/s) to suit the particular application, inordinate stress on the substrate and components is eliminated and blade wear is minimized.
The SDM236 is suited for medium to high-volume production and can separate individual strips up to 55 mm (2.16") wide with components up to 15 mm tall that are as close as 2 mm to the score line. The guide bar, height of the landing table, and the height of the center of the platform can also be adjusted accordingly to ensure quick and precise alignment of the score lines into the cutting blades.
- PCB Thickness
- 0.8 mm to 3.0 mm
- Maximum Depaneling Length
- 445 mm (17.5") or 483 mm (19")
- V-Scoring Lines Specs:
-
- Depth of scoring (A): ≥ 0.3 mm max (AL); ≥ 0.8 mm max (FR4)
- Remaining PCB thickness (B): 1.0 mm max (AL); 1.4 mm max (FR4)
- Component from scoring (C): ≥ 2 mm
- Scoring angle θ: ≥ 30˚ (typical)
- Max. component height (D): 15 mm
- Depaneling Mode
- Motorized
- Separating Speed
- 0 – 500 mm/s
- Production Rate
- Moderate to high volume
- Scoring Angle
- 30˚
- Minimum Component Distance from V-Groove
- 2 mm
- Maximum Component Height
- 15mm from the loading platform
- PCB Materials
- Aluminum or FR4
- Processing table
- 500 x 165 mm (19.7" x 6.5")
- Dimensions (L x W x H)
- 59” x 10.6” x 7.85"
Depanler: 15.75” x 15.75” x 13"
Loading Platform: 28.4” x 14.6” x 7.9”
Unloading Platform: 47.2” x 14.6” x 7.9” - Net Weight
- 40 kg (88 lbs)
- Shipping Weight
- 75 kg (165 lbs)
