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VP260 Bench Top Vapor Phase

The VP260 is Manncorp's vapor phase reflow oven recommendation for OEMs and contractors who maintain a high flexibility, low-to-medium-yield solder processing capability. This is the right machine for high mixes, short runs and fast changeovers that can be either lead or lead-free. Setup only involves loading the board holder which accepts PCBs of 11.8" x 10.2" (300 x 260mm), and activating a switch. No guesswork or downtime is involved since profiling is pre-determined by the boiling point of the fluid used. Or in special situations, dwell time can be preset by operator and stored in the system's memory. Processing is equally rapid, with soldering taking place as boards are indexed into the vapor phase zone when boiling point of fluid and melting point of solder are simultaneously reached. Boards are then indexed to cooling zone where evaporation dries and brings board to ambient temperature. Will the VP260 meet your production requirements? All it takes is a quick e-mail or phone call to find out. sales@manncorp.com or 800.PIK.MANN (745.6266). Unlike IR or convection batch-type ovens with temperatures that can vary, vapor phase soldering system provides fully controlled and evenly distributed temperature throughout the production cycle.

Quick Contact — TEXT or CALL:

Chris — East Coast: 215.869.8374

Ed — West Coast: 215.808.6266

VP260 Vapor Phase Soldering Oven, 30" wide

Specifications

Max. PCB Size 300 x 260 x 70 mm
(11.8" x 10.2" x 2.75")
Fluid Capacity 3 Kg (6.6 lbs)
Avg. Fluid Consumption 1.5 – 2 g/cycle
Cooling Water Flow Requirement 1 l/min (0.26 gal/min)
Cooling Water Supply 2.5 – 4.0 bar (35 – 60 psi) Tap water or recirculating chiller
Startup Time 15-20 min
Avg. Cycle Time 3 – 5 min (profile dependent)
Voltage Requirements 208V, three-phase, 50/60 Hz
Power Consumption 2.1 KW (Soldering)
0.9 KW (Standby Mode)
Dimensions (L x W x H) 770 x 710 x 680 mm
(30.3" x 28" x 26.8")
Net Weight 110 Kg (243 lbs)

Details

Works with full range of soldering liquids
In vapor phase soldering, heat transfer is at least 10X more efficient than in a convection oven and the maximum vapor temperature will never exceed the boiling point of the liquid. The inert, oxygen-free environment produces the highest quality solder joints and the low peak temperature has been proven to improve the long-term reliability of the finished product. The VP260 is compatible with any of the PFPE fluorinated fluids designed for eutectic or lead-free solders and can be ordered with liquids with boiling points from 200°C – 260°C. Fluids are supplied in 5 kg containers and the initial fill requires only 3 kg.
Dual-chamber design conserves fluid
A dual-chamber design and automatic PCB transport system make the VP260 extremely easy to operate, while minimizing loss of the soldering liquid due to drag-out and evaporation. Boards are placed in the 300 mm x 260 mm (11.8" x 10.2") work holder inside the loading chamber in the top left of the unit. After closing the compartment and starting the soldering sequence, a vapor flap (separating the loading chamber from the soldering chamber) opens and the transport mechanism gently moves the work holder into the soldering chamber. The vapor flap closes behind the work holder and remains closed until soldering is complete. The flap then opens and the PCB is moved back to the loading chamber for cooling.
Automatic fluid recovery and monitoring
The loading chamber, which doubles as the cooling chamber after soldering is complete, features a fluid recovery system that collects any fluid condensate that didn’t drain from the assembly and work holder in the soldering chamber. It also includes a heat exchanger that blows cool air across the assembly and draws residual vapor into the recovery system. The result is a fluid loss of less than 1.5 – 2.0 g/cycle.
Process viewing window
Unlike fully enclosed inline convection ovens, the VP260 includes a large process viewing window that allows operators and process engineers to observe soldering as it’s actually taking place.
Simple exhaust management
The compact VP260 system is easily installed in virtually any workspace without the need for complex ductwork and external venting. The efficient heat transfer and low-turbulence nature of vapor phase generates minimal exhaust. What little is generated can be collected through a few feet of flexible ducting and filtered in an inexpensive, low-volume fume extraction system — no need for any new holes in your walls or special permitting!
Optional closed-loop chiller
The cooling coil that maintains the height of the vapor in the VP260’s soldering chamber requires a water supply of 1 l/min (0.26 gal/min) at 2.5-4.0 bar (35-60 psi). While municipal tap water supplies meet this requirement in most locales, an optional closed-loop, recirculating chiller is also available that attaches to the VP260 with simple ½" NPT supply and return connections.
Optional IC/BGA desoldering tool
Expand the capabilities of any Manncorp Vapor Phase systems with the R-500 rework option that quickly and easily desolders and removes ICs and BGAs. Simply apply the special gummed tape to the underside of the placement arm before placing it on the targeted component. Start the solder program, and in moments the desoldered component is cleanly lifted off the PCB.
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