ML100 Vapor Phase Soldering Oven
The ML100 vapor phase reflow oven is designed for prototypers or other low-volume assemblers who presently solder SMD parts by hand or with ineffective soldering equipment. This version of our VP260 now enables these companies reap the speed, accuracy and efficiency of vapor phase soldering on a modest investment. The ML100 generates energy transfer automatically or by user-controlled adjustment of heating power. Based on the mass of the assembly being soldered, the machine will automatically govern the timing of the vapor chamber heating sequence, or the user can preselect heating duration from four available timers, which permit profile development for special production situations that involve longer or shorter thermal dwell times. Unlike IR or convection batch-type ovens with temperatures that can vary, vapor phase soldering oven provides fully controlled and evenly distributed temperature throughout the production cycle.
Specifications
| Width | 28" (730 mm) |
| Depth | 23" (600 mm) |
| Height | 23" (600mm) |
| Weight | 154 lbs. (70 kg) |
| Max. PCB Size | 11.8" x 10.8" x 3.1" (300 x 275 x 80mm) |
| Soldering Fluid Filling | 4 lbs. (2 kg) |
| Water Connection | 1/2" |
| Power Supply | 208-220 VAC, 2 kW, 16 A |
Details
- IC & BGA Desoldering Tool For Vapor Phase System
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Expand the capabilities of Manncorp Vapor Phase systems with the R-500 rework option that quickly and easily desolders and removes ICs and BGAs. Simply apply the special gummed tape to the underside of the placement arm before placing it on the targeted component. Start the solder program, and in moments the desoldered component is cleanly lifted off the PCB.
