Vapor Phase Soldering
Dual-chamber; 460mm x 410mm capacity;
Dual-chamber; 300mm x 260mm capacity;
Auto PCB transport; 300mm x 275mm capacity
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Manncorp Vapor Phase SystemsManncorp’s selection of vapor phase soldering systems make it easier than ever to capitalize on this reliable technology’s numerous advantages. No longer just a niche technology for military, avionics, medical, and other mission-critical applications, Manncorp’s new generation of vapor phase solutions allow all SMT assemblers to achieve superior, defect-free, and completely uniform soldering quality with 0% risk of overheating, trouble-free profiling, and instant product changeovers—with such economy and efficiency that, for many, it has become a much better solution than inline convection.
Solder complex, high-mix assemblies with BGAs and temperature-sensitive SMDs in the safest, most reliable way with reflow that takes place at the precise boiling point of the liquid medium (only 5° to 10° over the melting point of the solder paste). Lower soldering temperatures mean less stress on the components and PCB and have been proven to pay dividends in longer-term product reliability. All of Manncorp's vapor phase soldering systems feature automatic PCB transport, with programmable time and heater power settings, and are suited for prototyping through medium volume SMT assembly.