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CR-5000 5-Zone SMT Reflow Oven

Minimum floorspace with maximum performance, that’s what our 5-Zone SMT Reflow Oven model delivers. A compact solution for any mid-volume electronic assembler, this model provides quality performance, consistently impressive throughput, and low ΔTs across every board. With standard KIC predictive profiling allowing for an unprecedented level of control over energy efficiency, temperature, and production speed, this model is ideal for both SMT and LED assembly.

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Chris — East Coast: 215.869.8374

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CR-5000 Convection Reflow Oven

Specifications

Lead Free Yes
Nitrogen Available No
Mesh Belt Width 22.4" (570mm)
Pin Conveyor 17.7" Max. (450mm)
Conveyor Speed (per min) 16-71" (400-1800mm)
SMEMA Compatible Optional
Component Max. Height 30mm upper, 25mm lower
Forced Convection Yes
Number of Heating Zones 5 upper, 5 lower
Heated Tunnel Length 75" (1910 mm)
Delta T ±2° C
PID* Yes
Max Temperature 350° C
Ramp Time (from cold start) < 15 min
Flux Management System Yes
Control PC
On-Board Profiling Yes
Dimensions 3040 mm L x 1380 mm W x 1445 mm H
(120" L x 54" W x 57" H)
Weight approx. 1300 kg (2866 lbs.)
Power 220 V, 3-Phase, 97 A
Required Active Exhaust 400CFM per port
# of Exhaust Vents 2
Battery Backup UPS Uninterruptible Power Supply for Conveyor & PC
Hood Opening Mechanism Automatic Raise and Lower

*(Proportional-Integral-Differential)

Details

Independent Upper and Lower PID Temperature Controls
When you choose the CR-5000 for your facility, you’ll get the benefit of an oven that operates with an unimpeachable heating accuracy of ±1°C. In addition, a high-speed blower installed adjacent to each heat source provides our clients with maximum convection, ensuring a ensuring a ΔT of ±2°C across the PCB assembly. Our diffuser design also provides you with low-velocity, low-turbulence airflow to prevent any component shifting or other disturbances. Experience excellent reflow soldering results at a better throughput than many ovens of this size can match.

Accurate, real-time temperature profiling to match the specifications of any solder paste manufacturer is available with optional thermocouples attached at different, critical locations on the PCB and connected to the 3 standard built-in CR Series control software communication inputs.
Advanced Conveyor Systems
The combination of a 22.4” (570 mm) stainless steel mesh belt and an adjustable-rail, pin-type conveyor system allows your CR-5000 advanced conveyor system to meet any production requirement. All of your units components are constructed of high-quality and strength stainless steel and are made to maintain dimensional tolerances at the high temperatures required for lead-free processing.

Inline operation, double-sided boards, advanced automatic chain lubrication, motorized width adjustment, and programmable conveyor speed (16”-71” or 400-1800 mm per minute) come standard on the pin conveyor, while automatic pin conveyor width adjustment based on specific reflow program parameter settings is an available option.
Easy-to-Use Control Software
Your CR-5000 can be controlled with an attractive and colorful graphical user interface with a full-screen, virtual view of preset and actual zone temperatures, system status, and conveyor speeds. This full-screen display enables ease of use without taking a hit to total process management.- This units Windows-based control software allows for unlimited storage and networking capability along with advanced temperature profiling, timed automatic startup and shutdown, audio and visual alarms, and password protection functionality. Each unit features a 15” flat screen monitor, keyboard, and trackball along with a UPS battery backup to ensure safe removal of product from the oven in a power outage.

Profile Prediction

HOW 'AUTO FOCUS POWER' PROFILE PREDICTION WORKS:

1. Select Your Solder Paste Formula and Process Window
The KIC Auto-Focus Power software includes a database of over 1000 different solder paste formulas from dozens of different solder paste manufacturers. Each database entry includes the manufacturer's recommended solder profile for that specific solder paste formula and identifies critical specifications (i.e. maximum ramp rate, maximum cooling rate, temperatures for preheat, soak, reflow, and peak, allowable times above those temperatures, etc., with upper and lower limits for each) that define the process window. After selecting the solder paste, users can either use the profile as is or can modify the specifications to create a process window that meets their own unique criteria.
Process Window 2. Link Your Product to the Process Window
Once the Process Window is selected (defined), the next step in using Auto-Focus is selecting the product to be soldered (or assigning a name if the product has not yet been defined). This step, in effect, links the product to the selected process window. It also links the process window and the product to the CR Series Oven data in the database. The oven data has been produced by KIC's characterization of the unique thermal properties of specific CR Series oven models as they relate to varying product sizes and processes.
Product Process 3. Define the Product's Physical Characteristics
The user now enters the average length, average width, and total weight of the product.
Confirm-Recipe 4. Obtain and Confirm the Oven Settings
Auto-Focus now scans the built-in database for zone temperature/belt speed settings that produce a thermal profile that best fits within the process window when soldering a similarly sized product. By comparing that profile to the desired process window, Auto-Focus is able to estimate the PWI™ (Process Window Index); a single value that will give the user an indication of how far "within spec" the actual profile will be when using the recommended oven settings. If the PWI value is acceptable, the user can then obtain the exact temperature settings for each zone along with the belt speed.

 

Click here for More Information on AUTO FOCUS

Video

CR-5000 Lead-free 5-zone forced convection reflow oven

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