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CR-8000 8-Zone SMT Reflow Oven

A combination of 8 independently controlled full-convection heating zones (16), 2 cooling zones, and low-velocity, low turbulence air flow allows the CR-8000 reflow oven to provide you with thermal accuracy of ±1°C and a ΔT of ±2°C across PCB assemblies to 22" (570 mm) wide. This high-performance model takes up less floorspace than comparable alternatives on the market and offers a throughput that can keep pace with even high-volume production requirements. 

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CR-8000 8-zone SMT Reflow Oven

Specifications

General
Lead Free Compatible Yes
Tin Lead (SnPb) Compatible Yes
Nitrogen Atmosphere Compatible Optional
Double-Sided Board Processing Yes
CE Compliance Yes
SMEMA Compatible Standard
Board Handling
Heated Board Width 22.4" (570mm)
Mesh Belt Conveyor Standard
Mesh Belt Width 22.4" (570mm)
Process Clearance Above Mesh Belt 2.5" (65mm)
Chain-Driven Pin Conveyor Standard
Pin Conveyor Max. Width 17.7" (450mm)
Pin Conveyor Min. Width 1.97" (50mm)
Auto Adjust Pin Conveyor Optional
Clearance Above Conveyor Pins 1.18" (30mm)
Clearance Below Conveyor Pins .98" (25mm)
Powered Center Support Optional
Automatic Chain Lubrication Yes
Conveyor Speed 16-71"/min (400-1800mm/min)
Conveyor Height 35.4 ±0.8" (900mm ±20mm)
Conveyor Direction Left to Right
Component Max. Height 30mm upper, 25mm lower
Heating
Forced Hot Air Convection Yes
Number of Independently Controlled Heating Zones 16 total
8 upper, 8 lower
Total Heated Length 106" (2700 mm)
Number of Oven Convection Motors 16 Power: 120W x 16
Delta T ±2° C
Temperature Controls
PID (Proportional-Integral-Differential) Yes
Temperature Control Accuracy ±1° C
PCB Temperature Tolerance ±2° C
Temperature Range Ambient -350° C
Ramping Time (from cold start) < 15 min
Profiling / Thermocouple Channels 3
Cooling
Standard Cooling Method Air
Internal Chilled Water Cooling Optional
Number of Cooling Zones 1 (2 with water cooling)
Cooling Tunnel Length 25" (635 mm)
Exit Temperature 40°C
Number of Cooling Fans Three 45W or one 370W
Operating System and User Interface
Windows Compatible PC Yes
Touch Screen LCD No
Language English
On-Screen Thermal Profiling and Parameter Setting Yes
Print Capability Yes
Data Logging & Event Recording Yes
Alarms Audible, Visual (Light Tower) and On-Screen Display
Dimensions & Physical Characteristics
Length 189" (4800 mm)
Width 59.4" (1510 mm)
Height 61" (1550 mm)
Net Weight 3990 lbs. (1810 kg)
Utilities
Power Supply 220 VAC 3-Phase
Number of Exhaust Vents
Required Active Exhaust 400CFM per port
Battery Backup Uninterruptible Power Supply for Conveyor & PC
Miscellaneous
Hood Opening Mechanism Automatic Raise and Lower

Details

Compact, High-Performance, Mid-to-High-Volume SMT Reflow Ovens
If your budget and floorspace are at a premium but you’re still looking for an oven that can provide higher temperatures and a tighter process window with low margin of error in lead-free reflow soldering, Manncorp’s CR-8000 is your medium or high-volume production solution.

Our 8-zone CR-8000 is 20%-30% shorter in length than other options with the same zone number and comparable throughput on the market. It also comes in at a lower price tag. The key to this compact and economic design is our proprietary combination of high-mass heat sources coupled with an efficient thermal transfer process that ensures uniform heating and unparalleled stability despite varying loads.
Independent Upper and Lower PID Temperature Controls for Each Heating Zone
The CR-8000’s heating zone temperature controllers permit precise temperature profiling with an accuracy of ±1°C. With the addition of the high-speed blower installed adjacent to each heat source for maximum convection, you’re guaranteed a ΔT of ±2°C across the PCB assembly. This diffuser design provides our clients with low-velocity, low-turbulence air flow that prevents component shifts or disturbances.

If you’re looking for accurate, real-time temperature profiling to ensure the reflow process matches your solder paste manufacturer’s specifications, we offer optional thermocouple installations at critical locations on the PCB. Each oven comes with 3 built-in inputs standard for communication with the CR Series control software.

KIC Auto Focus Profile Prediction software offers you complete control over zone temperatures and belt speed settings for optimal temperature gradients, energy efficiency, or speed of production. Simply select your solder past formula and process window, specify your product’s physical characteristics, and our software will provide you with zone temperature and belt speed settings for the job.
Pin-Over-Mesh Conveyors
Our 8-zone oven can meet virtually any product specification or production requirement with its standard adjustable-rail, pin-type conveyor. This system can handle PCBs up to 450 mm (17.7”) installed over a 570 mm (22”) stainless-steel mesh belt. With double-sided and inline processing capabilities, this belt is ideal for fast changeovers.

Each of our components is composed of high-quality, high-strength stainless steel and built to maintain dimensional tolerances at the high temperatures required by lead-free processing, eliminating the possibility of jams or dropped PCB assemblies.

Standard pin conveyor features for the 8-zone model include advanced automatic chain lubrication and motorized width adjustment. In addition, the conveyor speed is programmable from 400-1800 mm (16”-71”) per minute to accommodate your processing requirements.

Additional pin conveyor options include automatic width adjustment based on parameter settings for specific reflow programs and a center support system to prevent board warpage for processing of larger PCBs at higher lead-free temperatures.
Nitrogen Atmosphere Compatible Models
The CR-8000 is available in both standard and nitrogen-compatible configurations for those clients who want the flexibility of soldering in both environments.

It’s widely agreed that oxygen reduction through inert gas introduction (usually N2) allows for a wider process window and better solder joints through a reduction of oxidation. Our nitrogen-compatible heating chamber’s enhanced flow design lends itself to efficient heat transfer and ensures low nitrogen consumption while maintaining O2 levels of 300-1000 ppm.
Internal Water Cooling
Aggressive cooling is often necessary to reduce peak temperature exposure times in the lead-free soldering process as the higher liquid temperatures required approach the limits of numerous SMT components and PCB assemblies. That’s why our 8-Zone oven offers internal water-chilled recirculating cooling, allowing you to alter cooling rates to meet solder past manufacturers’ recommendations more accurately than possible with only air-cooling capabilities.
Process Management Capabilities
A clean, colorful, and easy-to-navigate visual UI allows you to operate and control any of our CR Series reflow systems. This interface features a full-screen, virtual view of the system with an array of preset and actual zone temperatures alongside system status and conveyor speed updates.

The operating system for each CR-8000 includes advanced functions such as temperature profiling, timed automatic startup and shutdown options, audiovisual alarm options, and password protection.

This Windows-based operating system and control software is loaded onto a PC controller with unlimited storage and networking capability, a 15” flat-screen monitor, keyboard, and trackball. All of our systems employ a UPS backup to ensure removal of product from the oven in the event of a power outage for your safety.

Profile Prediction

HOW 'AUTO FOCUS POWER' WORKS:

1. Select Your Solder Paste Formula and Process Window
The KIC Auto-Focus Power software includes a database of over 1000 different solder paste formulas from dozens of different solder paste manufacturers. Each database entry includes the manufacturer's recommended solder profile for that specific solder paste formula and identifies critical specifications (i.e. maximum ramp rate, maximum cooling rate, temperatures for preheat, soak, reflow, and peak, allowable times above those temperatures, etc., with upper and lower limits for each) that define the process window. After selecting the solder paste, users can either use the profile as is or can modify the specifications to create a process window that meets their own unique criteria.
2. Link Your Product to the Process Window
Once the Process Window is selected (defined), the next step in using Auto-Focus is selecting the product to be soldered (or assigning a name if the product has not yet been defined). This step, in effect, links the product to the selected process window. It also links the process window and the product to the CR Series Oven data in the database. The oven data has been produced by KIC's characterization of the unique thermal properties of specific CR Series oven models as they relate to varying product sizes and processes.
3. Define the Product's Physical Characteristics
The user now enters the average length, average width, and total weight of the product.
4. Obtain and Confirm the Oven Settings
Auto-Focus now scans the built-in database for zone temperature/belt speed settings that produce a thermal profile that best fits within the process window when soldering a similarly sized product. By comparing that profile to the desired process window, Auto-Focus is able to estimate the PWI™ (Process Window Index); a single value that will give the user an indication of how far "within spec" the actual profile will be when using the recommended oven settings. If the PWI value is acceptable, the user can then obtain the exact temperature settings for each zone along with the belt speed.

Click here for More Information on AUTO FOCUS

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