CR6000 6-Zone SMT Reflow Oven
A combination of high-mass heat sources and efficient thermal transfer allows the CR6000 to provide excellent reflow soldering results and throughput with a shorter-than-average heating tunnel. Your 6-zone unit also includes advanced features such as a wide combination pin-over-mesh belt conveyor, partnered pre-loaded KIC Auto Focus profile predictions software, and real-time thermal profiling standard.
QUESTIONS? TEXT OR CALL
- Chris Ellis 215-869-8374
- EAST COAST
- Ed Stone 215-808-6266
- WEST COAST
- Upgrade for 24 inch edge rail width - must be factory ordered + $6,995.00
- Nitrogen Option + $15,000.00
- Internal, water-chilled recirculating heat exchanger + $8,990.00
- Automatic width adjustment of the pin conveyor based on the parameter settings for specific reflow programs + $1,295.00
- CR Series Spare Parts Kit (must be ordered w/machine) + $695.00
- SMEMA Interface + $995.00
- External thermocouple + $125.00
- YME-41Kx2M RKC:
- Internal thermocouple + $125.00
- Installation and Training + $3,500.00
High-Heat, Lead-Free Soldering in a Shorter Tunnel
Our revolutionary CR6000 can provide low-, medium-, and high-volume manufacturers in a variety of PCB industries a reliable solution to the challenges posed by lead-free reflow soldering, including higher temperatures and a tighter process window resulting in a low margin for error.
Our 6-zone models are 20%-30% shorter than comparable systems with the same number of zones and commensurate throughput. They also offer a lower price tag than other options on the market, making them a great choice when factory floorspace and budgetary room are both at a premium. The key to this is a proprietary design that features high-mass heat sources combined with efficient thermal heat transfer capabilities, giving you the uniform heating and exceptional process stability that you’re looking for, even in the face of varying loads.
Precise Temperature Profiling
The CR6000's heating zone temperature controllers have an accuracy of ±1°C and, in conjunction with a high-speed blower adjacent to each heat source for maximum convection, ensure a ΔT of ±2°C across the PCB assembly. The system's diffuser design also provides low-velocity, low-turbulence air flow to prevent component shift or disturbance.
Optional thermocouples can be attached at different, critical locations on the PCB, and connect to three built-in inputs (standard) on the oven for communication with CR Series control software and accurate, real-time temperature profiling to match any solder paste manufacturer's specifications.
Included KIC Auto Focus profile prediction software takes the guesswork out of setting up new profiles: simply choose your solder paste formula and process window, specify your physical characteristics, and Auto Focus returns optimal zone temperature and belt speed settings.
Advanced Conveyor Systems
No matter your product specification or production requirement, the standard combination 22” (570 mm) stainless steel mesh belt and adjustable-rail, pin-type conveyor system supplied with the CR6000 can handle PCBs up to 17.7’ (450 mm) in size at maximum. Conveyor speed is programmable in a range of 16”-71” (400-1800 mm) per minute to accommodate your needs. We also offer options such as automatic width adjustment of the pin conveyor based on specific reflow program parameter settings.
All of the CR6000’s components are constructed of high-quality, high-strength stainless steel, built to maintain dimensional tolerances at high lead-free processing temperatures while eliminating the possibility of jammed or dropped PCB assemblies.
Process Management Functionality
The CR6000’s Windows-based oven management software includes advanced temperature profiling, timed automatic startup and shutdown, audiovisual alarms, and password protection functionality. The control of this reflow system is accomplished through an easily navigable user interface featuring a full-screen virtual view of the system and a display of preset and actual zone temperatures, system status readings, and conveyor speeds. Every system features a UPS battery backup that functions in case of a power outage, ensuring the removal of all product out of the oven for your safety.
Our PC controller systems offer unlimited storage, networking capabilities, a 15” flat screen monitor, and keyboard and trackball.
Nitrogen Atmosphere Compatible
Our models offer nitrogen compatible configurations for manufacturers who want to be flexible in soldering in both air and inert reflow atmosphere environments. Experts agree that oxidation reduction through inert gas (generally N2) introduction allows a wider process window, providing better solder joints. Our nitrogen-configured CR6000’s heating chamber lends itself to efficient heat transfer and low nitrogen consumption while maintaining O2 levels of 300-1000 ppm through an enhanced flow design.
Critical Cooling Rate Control
Aggressive cooling is often necessary to reduce peak temperature exposure times in lead-free soldering processes due to higher liquidus temperatures approaching the limits of numerous SMT components and PCB assemblies. Our CR6000 utilizes an internal water-chilled recirculating cooling system which allows our clients to alter cooling rates, meeting solder past manufacturers’ recommendations to a greater degree than possible with exclusive standard air cooling systems.
|Lead Free Compatible||Yes|
|Tin Lead (SnPb) Compatible||Yes|
|Nitrogen Atmosphere Compatible||Optional|
|Double-Sided Board Processing||Yes|
|Heated Board Width||22.4" (570 mm)|
|Mesh Belt Conveyor||Standard|
|Mesh Belt Width||22.4" (570 mm)|
|Process Clearance Above Mesh Belt||2.5" (65 mm)|
|Chain-Driven Pin Conveyor||Standard|
|Pin Conveyor Max. Width||17.7" (450 mm)|
|Pin Conveyor Min. Width||1.97" (50 mm)|
|Auto Adjust Pin Conveyor||Optional|
|Clearance Above Conveyor Pins||1.18" (30 mm)|
|Clearance Below Conveyor Pins||0.98" (25 mm)|
|Powered Center Support||Optional|
|Automatic Chain Lubrication||Yes|
|Conveyor Height||35.4 ±0.8" (900 mm ±20 mm)|
|Conveyor Direction||Left to Right|
|Component Max. Height||30 mm upper, 25 mm lower|
|Forced Hot Air Convection||Yes|
|Number of Independently Controlled
6 upper, 6 lower
|Total Heated Length||80.7" (2050 mm)|
|Number of Oven Convection Motors||12 Power: 120W x 12|
|Delta T||±2° C|
|Temperature Control Accuracy||±1° C|
|PCB Temperature Tolerance||±2° C|
|Temperature Range||Ambient -350° C|
|Ramping Time (from cold start)||< 15 min|
|Profiling / Thermocouple Channels||3|
|Standard Cooling Method||Air|
|Internal Chilled Water Cooling||Optional|
|Number of Cooling Zones||1 (2 with water cooling)|
|Cooling Tunnel Length||24.4" (620 mm)|
|Number of Cooling Fans||Three 45W or one 370W|
|OPERATING SYSTEM AND USER INTERFACE|
|Windows Compatible PC||Yes|
|Touch Screen LCD||No|
|On-Screen Thermal Profiling and
|Data Logging & Event Recording||Yes|
|Alarms||Audible, Visual (Light Tower)
and On-Screen Display
|DIMENSIONS & PHYSICAL CHARACTERISTICS|
|Length||164" (4150 mm)|
|Width||59.4" (1510 mm)|
|Height||61" (1550 mm)|
|Net Weight||3329 lbs. (1510 kg)|
|Power Supply||220 VAC 3-Phase|
|Operating Power Consumption||8-14 KW|
|Start-Up Power (Sequential Start-Up
|Current (Sequential Start-Up Mode*)||83A|
|Total Power (Maximum)||46 KW|
|N² Consumption||20-30 m3/h (with N² option)|
|Oxygen Density||300-1000 ppm (with N² only)|
|Number of Exhaust Vents||3|
|Exhaust Opening Size||8" diameter|
|Exhaust Venting Volume||400CFM per port|
|Conveyor & PC Power Supply||Uninterruptible Power Supply
for Conveyor & PC
|*SEQUENTIAL START-UP MODE IS THE DEFAULT START-UP MODE
AND LIMITS CURRENT DRAW DURING START-UP.
|Hood Opening Mechanism||Automatic Raise and Lower|
HOW 'AUTO FOCUS POWER' PROFILE PREDICTION WORKS:
1. Select Your Solder Paste Formula and Process Window
The KIC Auto-Focus Power software includes a database of over 1000 different solder paste formulas from dozens of different solder paste manufacturers. Each database entry includes the manufacturer's recommended solder profile for that specific solder paste formula and identifies critical specifications (i.e. maximum ramp rate, maximum cooling rate, temperatures for preheat, soak, reflow, and peak, allowable times above those temperatures, etc., with upper and lower limits for each) that define the process window. After selecting the solder paste, users can either use the profile as is or can modify the specifications to create a process window that meets their own unique criteria.
2. Link Your Product to the Process Window
Once the Process Window is selected (defined), the next step in using Auto-Focus is selecting the product to be soldered (or assigning a name if the product has not yet been defined). This step, in effect, links the product to the selected process window. It also links the process window and the product to the CR Series Oven data in the database. The oven data has been produced by KIC's characterization of the unique thermal properties of specific CR Series oven models as they relate to varying product sizes and processes.
3. Define the Product's Physical Characteristics
The user now enters the average length, average width, and total weight of the product.
4. Obtain and Confirm the Oven Settings
Auto-Focus now scans the built-in database for zone temperature/belt speed settings that produce a thermal profile that best fits within the process window when soldering a similarly sized product. By comparing that profile to the desired process window, Auto-Focus is able to estimate the PWI™ (Process Window Index); a single value that will give the user an indication of how far "within spec" the actual profile will be when using the recommended oven settings. If the PWI value is acceptable, the user can then obtain the exact temperature settings for each zone along with the belt speed.