MC301 Benchtop Batch Reflow Oven
Match your solder paste manufacturers’ precise specifications for preheat, soak, reflow, and cooling with the MC301 Batch Reflow Oven. By simulating the conditions of an inline reflow system in a benchtop unit, the MC301 is ideal for product development, prototyping, and manufacturability testing. Detailed solder profiles are easily programmed, stored, and downloaded through the MC301’s exclusive hardware control app and Android operating system. Android architecture also allows users to take advantage of touch screen operation and integrated wireless networking for data transfer.
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- Chris Ellis 215-869-8374
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- Ed Stone 215-808-6266
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Design Ideal for Labs and Small-Scale Production
Measuring only 29.2” L x 23.75” W x 12.5” H (742 mm L x 603 mm W x 318 mm H) and weighing under 150 pounds, the MC301 easily installs on virtually any benchtop. Its ability to simulate inline reflow profiles with preheat, soak, reflow, and cooling phases makes it a great choice for labs or other installations where space is often at a premium. The front-loading heating chamber has an effective soldering area of 9.84” x 7.87” (250 mm x 200 mm) and includes a window for viewing of the soldering process.
Easy Installation - Up and Running in No Time
The MC301 has an average power rating of 3.6 KW (6.3 KW, peak) and requires a 220-240V, single-phase, voltage supply rated at 30 amps. Built-in circulation fans provide air flow for heating and cooling, and hot air is exhausted through a 2.5" flanged outlet on the rear of the unit. For removal of flux fumes, it is recommended to hook up a non active flexible hose or a vent hood.
Exclusive Android-Based Control Application
The MC301 Android-based control app provides an easy-to-use, touch-panel interface with virtual keyboard for setting the temperature and duration of the preheat, soak, reflow, and cooling stages. In the reflow zone, the user can specify the dwell at both the melting and peak temperatures. Based on these settings, the system will also automatically calculate the heating or cooling rate in each stage for verification with solder paste and component manufacturers' specifications. In addition, when heater control is based on the higher temperature measured at the heaters, the system displays the calculated board temperature based on a calibrated offset.
Real-Time Temp Control via On-Board TC
In the MC301's password-protected advanced settings, the unit can be switched into a separate control mode that uses real-time feedback from a built-in, flying thermocouple. In this mode, with the thermocouple attached at a strategic location on the PCB surface, heater control is based on the actual temperature measured at the thermocouple. As you can see in this screen capture, the target temperature is equal to the thermocouple temperature and there is no offset.
Temp Recordings Easily Saved & Distributed via WiFi
In the run mode, the high-resolution touch-panel displays a graphical representation of the heat zone temperature (red) versus the PCB temperature (yellow) throughout the reflow cycle. For process control and traceability, screens can be saved as separate files and distributed electronically via Email or across networks using the Android OS and built-in WiFi capability.
|Applicable Solder Types||Lead-Free or SnPb|
|Heating Method||IR & Forced Hot Air Convection|
|User Interface||Android Software Platform
Ultra High Resolution Touchscreen
Integrated WiFi & Networking
|Effective Soldering Area||9.84" x 7.87" (250 mm x 200 mm)|
|Temperature Range||Ambient - 310 °C|
|Temperature Precision||±2 °C|
|Temperature Control Method||PID Control; SSR Contactless Switch Circuit|
|Warm-Up Time||Approx. 2.5 min.|
|Power||3.6 KW (avg.); 6.3 KW (max.)|
|Voltage||220 V, Single Phase, 50/60 Hz|
|Exhaust Temperature (approx.)||60 °C|
|Dimensions||29.2" L x 23.75" W x 12.5" H
(742 mm L x 603 mm W x 318 mm H)
|Weight||Approx. 148 lbs. (67 kg)|