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MC301 Benchtop Batch Reflow Oven
- Soldering Area: 250 mm x 200 mm
- Preheat, Soak, Reflow, & Cooling
- Size: 29.2” L x 23.75” W x 12.5” H
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MC301N Benchtop Batch Reflow Oven
- Soldering Area: 250 mm x 200 mm
- Nitrogen-Compatible Version
- Size: 27.2" L x 18.9" W x 11" H
Solder reflow ovens are available for all levels of SMT PCB assembly, from prototyping to full production. Benchtop or desktop reflow ovens are ideal for low-volume production areas with limited space. Each solder reflow station uses hot air convection for excellent solder reflow results. Programmable stations are able to mimic the solder profiles of full-sized reflow ovens.
Full-sized Inline SMT Reflow Ovens for high volume production and large areas. VIEW