HPX1S Die Attach Machine
Produce high-quality semiconductor chips in your manufacturing facility with our HPX1S Die Attach Machine. This die bonding machine is great for high-accuracy, low-volume, die attach manufacturing needs. Customization options are also available for unique applications. It is equipped with 3 sets of CCD cameras and a bottom camera to help with component alignment. Easily and accurately handle die sizes from 1.4 x 1.4 mm to 7 x 7 mm.
QUESTIONS? TEXT OR CALL
- Chris Ellis 215-869-8374
- EAST COAST
- Ed Stone 215-808-6266
- WEST COAST
- Inline Conveyor for HPX1S + $5995.00
- Feeder Base for HPX1S + $1495.00
- Nozzle Changer for HPX1S + $1995.00
- Installation and Training + $3,500.00
HIGHLY ACCURATE AND STABLE
With an XY repeatability of ± 1.5μm and an XY placement accuracy of ± 25μm, this is a highly precise die attach machine that can be trusted to help your company produce high-quality semiconductor chips. The 8” magnetic waffle frame allows the machine to pick die attach components from size 1.4 x 1.4 mm to 7 x 7 mm.
GREAT FOR LOW-VOLUME, PROTOTYPE, AND CUSTOM APPLICATIONS
The high level of accuracy performed by this die attach machine makes it a perfect solution for prototyping, lab settings, low-volume assembly, on-demand production, and custom applications.
The software on this equipment is Windows 7, ensuring a short learning curve for operators. Different methods are available for programming, tailoring the machine to your needs with Teach-In and Matrix Data Input systems.
|HPX1S Die Attach Specifications|
|XY Repeatability||± 1.5μm|
|XY Placement Accuracy||± 25μm|
|R Rotation Accuracy||±0.3°|
|PCB Holding||Vacuum with Sensor|
|Working Table Area||max 9.84" x 9.84" (250 x 250 mm)|
|Wafer Frame Size||8" (Outer Dimension 296mm)|
|Component Size||1.4 x 1.4 mm – 7 x 7 mm|
|Camera System||CCD x 3 Sets|
|Camera Resolution||1.3 M & 3 M|
|Component Alignment||Digital Bottom Camera|
|Production Rate||1100 UPH|
|Storage||120GB SSD and 1TB HDD Back up|
|Air Requirement||80 psi (5.5bar) @ 150 Liter/min.|
|Grip Ring Handler||For Wafer Ring|
|Power Requirement||200-230 VAC, 50-60Hz, 1.5kW|
|Dimensions (LxWxH)||35.8” x 59” x 71.6” (910 x 1500 x 1820 mm)|