HPX1S Die Attach Machine

Produce high-quality semiconductor chips in your manufacturing facility with our HPX1S Die Attach Machine. This die bonding machine is great for high-accuracy, low-volume, die attach manufacturing needs. Customization options are also available for unique applications. It is equipped with 3 sets of CCD cameras and a bottom camera to help with component alignment. Easily and accurately handle die sizes from 1.4 x 1.4 mm to 7 x 7 mm.

Requires Account Log-In or Sign-Up

QUESTIONS? TEXT OR CALL

Chris Ellis 215-869-8374
EAST COAST
Ed Stone 215-808-6266
WEST COAST
PRINT
HPX1S-IC:
Inline Conveyor for HPX1S + $5995.00
HPX1S-FB:
Feeder Base for HPX1S + $1495.00
HPX1S-NC:
Nozzle Changer for HPX1S + $1995.00
INSTL&TRN:
Installation and Training + $3,500.00

HIGHLY ACCURATE AND STABLE

With an XY repeatability of ± 1.5μm and an XY placement accuracy of ± 25μm, this is a highly precise die attach machine that can be trusted to help your company produce high-quality semiconductor chips. The 8” magnetic waffle frame allows the machine to pick die attach components from size 1.4 x 1.4 mm to 7 x 7 mm.

GREAT FOR LOW-VOLUME, PROTOTYPE, AND CUSTOM APPLICATIONS

The high level of accuracy performed by this die attach machine makes it a perfect solution for prototyping, lab settings, low-volume assembly, on-demand production, and custom applications.

EASY PROGRAMMING

The software on this equipment is Windows 7, ensuring a short learning curve for operators. Different methods are available for programming, tailoring the machine to your needs with Teach-In and Matrix Data Input systems.

HPX1S Die Attach Specifications
XY Repeatability ± 1.5μm
XY Placement Accuracy ± 25μm
R Rotation Accuracy ±0.3°
PCB Holding Vacuum with Sensor
Working Table Area max 9.84" x 9.84" (250 x 250 mm)
Wafer Frame Size 8" (Outer Dimension 296mm)
Component Size 1.4 x 1.4 mm – 7 x 7 mm
Camera System CCD x 3 Sets
Camera Resolution 1.3 M & 3 M
Component Alignment Digital Bottom Camera
Production Rate 1100 UPH
Storage 120GB SSD and 1TB HDD Back up
Air Requirement 80 psi (5.5bar) @ 150 Liter/min.
Grip Ring Handler For Wafer Ring
Ejector Pin Ejector
Power Requirement 200-230 VAC, 50-60Hz, 1.5kW
Dimensions (LxWxH) 35.8” x 59” x 71.6” (910 x 1500 x 1820 mm)

For equipment suggestions specific to your production needs,
email sales@manncorp.com or contact one of our Sales Managers:

Chris Ellis - EAST COAST 215.869.8374

Ed Stone - WEST COAST 215.808.6266

Privacy Policy | Terms & Conditions
@ 2021 Manncorp.com. All Rights Reserved