SDM101 Manual PCB Depaneling Tool
The SDM101 precision depaneler combines a topside circular cutter with a below-board linear knife for smooth, burr-free separation of PCBs along the scoring groove. The design of the SDM101 eliminates stress on the board and the components during the separation process, preventing post-breakout-related board, component and solder joint defects even when components are located as close as 1 mm to the scoring line. SDM101 can be used with panels that are v-scored in the X direction or X & Y directions and PCB thicknesses from 0.8 mm to 3.0 mm. The large processing table can be angled to permit processed boards to fall away. This low-maintenance PCB separator requires no power or air for $0 utility costs and the ability to use the machine anywhere in the facility. Sturdy, heavy-duty design. A shatterproof Plexiglas safety shield protects operator from cutting blade.
QUESTIONS? TEXT OR CALL
- Chris Ellis 215-869-8374
- EAST COAST
- Ed Stone 215-808-6266
- WEST COAST
- PCB Thickness
- 0.8 mm to 3.0 mm
- Maximum Depaneling Length
- 445 mm (17.5") or 483 mm (19")
- V-Scoring Lines Specs:
-
- Depth of scoring (A): ≥ 0.25 mm
- Remaining PCB thickness (B): 1.0 mm max
- Component from scoring (C): ≥ 1 mm
- Scoring angle θ: ≥ 20˚ (typical)
- Max. component height (D): 32 mm
- Depaneling Mode
- Manual
- Separating Speed
- Dependent on operator
- Production Rate
- Moderate volume
- Scoring Angle
- 20Ëš
- Minimum Component Distance from V-Groove
- 1 mm
- Maximum Component Height
- 32 mm (1.26")
- PCB Materials
- FR4, CEM3, etc.
- Processing table
- 500 x 165 mm (19.7" x 6.5")
- Dimensions (L x W x H)
- 750 mm x 240 mm x 742 mm
(29.5" x 9.4" x 18.5") - Net Weight
- 32 kg (70.5 lbs)
- Shipping Weight
- 66 kg (146 lbs)
