SDM101 Manual PCB Depaneling Tool

The SDM101 precision depaneler combines a topside circular cutter with a below-board linear knife for smooth, burr-free separation of PCBs along the scoring groove. The design of the SDM101 eliminates stress on the board and the components during the separation process, preventing post-breakout-related board, component and solder joint defects even when components are located as close as 1 mm to the scoring line. SDM101 can be used with panels that are v-scored in the X direction or X & Y directions and PCB thicknesses from 0.8 mm to 3.0 mm. The large processing table can be angled to permit processed boards to fall away. This low-maintenance PCB separator requires no power or air for $0 utility costs and the ability to use the machine anywhere in the facility. Sturdy, heavy-duty design. A shatterproof Plexiglas safety shield protects operator from cutting blade.