ULTIMA NEO-L All-in-One Selective Soldering System

The ULTIMA NEO-L combines high-precision selective flux application with fully programmable point-to-point or continuous-linear soldering to solder through-hole components and connectors to SMT boards with complete accuracy and reliability.


Chris Ellis 215-869-8374
Ed Stone 215-808-6266
2.5 mm ID round nozzle + $895.00
3.0 mm ID round nozzle + $895.00
4.0 mm ID round nozzle + $895.00
5.0 mm ID round nozzle + $895.00
6.0 mm ID round nozzle + $895.00
7.0 mm ID round nozzle + $895.00
8.0 mm ID round nozzle + $895.00
9.0 mm ID round nozzle + $895.00
10.0 mm ID round nozzle + $895.00
12.0 mm ID round nozzle + $895.00
14.0 mm ID round nozzle + $895.00
16.0 mm ID round nozzle + $895.00
14.0 mm ID round nozzle + $895.00
20.0 mm ID round nozzle + $895.00
14 mm x 55 mm square nozzle for rework + $895.00
Bottom-side witness camera (non-retrofittable) + $2495.00
Scanner input and Gerber data conversion software + $3995.00
Low-level solder alarm (non-retrofittable) + $1995.00
Weekly timer for auto startup/shutdown + $1495.00
ULTIMA SSP Benchtop Selective Fluxing Machine + $29995.00
Installation and Training + $3500.00

Large Board Holder and Precision X-Y-Z Drive Mechanism

The ULTIMA NEO-L features an extra-large PCB holder and spacious work envelope for fluxing and soldering boards up to 18" x 15" (460 mm x 380 mm) in a single pass. The ultra-fine resolution X-Y-Z axis drive mechanism boasts a positional accuracy of ±0.004" (±0.1 mm) and can travel at programmable speeds as slow as 0.004"/sec (while soldering) to as fast as 15.75"/sec (between points).

Highly Responsive Solder Pump for Precise Control of Miniature Wave

This close-up shows the precision and uniformity of the wave shape as the molten solder flows out of the top of the nozzle in the ULTIMA NEO-L selective soldering machine. The ULTIMA NEO-L's highly responsive solder pump allows precise and virtually instantaneous control of miniature wave height and solder volume by varying the pump speed (rpm) and acceleration/deceleration (rpm/s). To prevent oxidation, an exclusive nitrogen micro-heater, controllable to 400°C, is located within the hood surrounding the wave nozzle. Close proximity of the heater to the nozzle ensures a stable wave temperature as nitrogen flows through the hood and shrouds the molten solder joint.

Solder Connectors with Parallel Rows of Pins in a Single Pass

For higher throughput, tandem rows of multiple leads can be soldered in a single pass, provided that the use of a nozzle with a sufficiently large I.D. or width is used. Custom rectangular-shaped wave nozzles are also available upon special request. For assistance in selecting the proper nozzle size and shape, please submit a PCB sample to your Manncorp sales or customer service representative.

Wide Variety of Quick-Change Nozzles Available

A wide range of round-shaped nozzles are available with inside diameters across 2.5 mm (0. 1") to 20 mm (0.79"). The highly-polished stainless steel surface allows smooth laminar flow of the wave over the nozzle surface for highly-stable wave form and extremely stable wave temperature. The inside diameter of the nozzle controls the overall diameter of the wave. The optimum nozzle size for a particular application is a function of the area to be soldered, the proximity of adjacent components, and the desired throughput.

Compact Solder Pot Slides In and Out for Easy Maintenance

The ULTIMA NEO-L's unique compact design allows the 16 kg solder pot and pump module to remain stationary during operation while the programmable PCB positioner moves the board over the wave nozzle in the X, Y, and Z axes. The module is easily accessible for loading of bars or pellets and slides in and out in seconds for routine maintenance. A larger 32 kg pot, a low solder level alarm and an automatic wire solder feeder are available as options.

View and Record Live Video of Soldering Operations

An optional high-definition witness camera with adjustable LED lighting, located below the PCB positioner and focused at the top of the nozzle, allows operators to view and record soldering operations in real-time.

Generate Program Data From PCB Scans or Gerber Data Import

The Windows®-compatible software accepts direct numeric data input for easy program creation either online or offline. Programs can also be created via Gerber data import or even scanned JPEG images of PCBs (as shown in this screen capture) with optional software. Selective soldering functions can be defined as lines or points using an easy to use visual editor. Programs created for soldering are automatically converted to selective fluxing data.

Wave Simulation Mode Checks Solder Coverage Area

After the soldering coordinates have been entered, a handy wave width simulation mode allows the user to check the wave coverage area, based on the nozzle size selected for the individual lines and points.

Editable Parameters for Complete Control of All Soldering Functions

Data entered via the visual editor or Gerber data import is automatically arranged in a tabular format (as shown in this screen capture). The powerful NEO-L software provides a wide variety of editable parameters for each soldering step that ensures perfect, repeatable soldering every time. Users can edit the default parameters for control of Z-axis dip height, preheat dwell, X-Y speed, pump flow (rpm), and acceleration/deceleration (rpm/s); parameters critical to the prevention of bridging, icicling, and other defects. The software also automatically calculates the amount of time required for the completion of each soldering program.

Easy Import and Conversion of Gerber Data Into Soldering Programs

When Gerber data is imported via the optional software, the PCB image is automatically drawn on the visual editor screen. From here, the user can easily choose the pads to be soldered and can define them as individual points or convert selected groups of pads into continuous lines.

High-Precision Spray Fluxing

The precision spray nozzle used in the NEO-L can deliver either round or very thin linear spray patterns with a very small amount of liquid flux, keeping consumable costs low. Independent pressure controls for the integral flux reservoir and atomizer allow the user to regulate the volume and density of the spray jet and ensure a precise, uniform flux application.

Selective Fluxing Programs Automatically Generated From Soldering Data

Soldering coordinate data created for the ULTIMA NEO-L is automatically converted to selective fluxing programs by the ULTIMA Series software application.

PCB Holder and X-, Y-, Z-Axis Drive Mechanism

Maximum PCB Size
380 mm x 460 mm (15" x 18")
Minimum PCB Size
50 mm x 50 mm (2" x 2")
PCB Thickness
0.8 mm - 2.0 mm (.032" - .080")
PCB Warp
0.5 mm (0.020") maximum
Maximum PCB Weight
2 kg (4.4 lbs.) including components;
4 kg (8.8 lbs.) capacity optional
Component Lead Length
3 mm (0.12") recommended maximum
Component Height (Top Side)
50 mm (2") maximum above PCB top side
Component Height (Bottom Side)
Soldering path programmable to avoid components and assemblies mounted on bottom side. Click here for diagram with maximum and minimum dimensions.
PCB Edge Clearance
3 mm (0.12") for components;
5 mm (0.20") for solder pad edge
Positional Accuracy
±0.1 mm (±0.004")
X-Axis Resolution
0.032 mm (0.0013")
Y-Axis Resolution
0.033 mm (0.0013")
Z-Axis Resolution
0.008 mm (0.0003") 50cm2/sec
Travel Speed (While Soldering)
Programmable from 0.1 mm/sec - 10.0 mm/sec
(0.004"/sec - 0.4"/sec)
Travel Speed (Between Points)
400 mm/sec (15.75"/sec) maximum

Nitrogen Preheater

Heating Method
Micro Heater and Temperature Sensor Integrated with Nozzle Hood
Temperature Range
Ambient to 400 °C (Inside Nozzle Hood)
Heater Power
1.3 KW x 1 pc.
Nitrogen Consumption
25 liters/min
Nitrogen Flow Control
Digital Flowmeter and Pressure Regulator

Solder Wave and Bath

Solder Types
Both Lead-Free and Conventional Sn/Pb Solders; Second Separate
Solder Pot Recommended When Using Both Types
Wave Diameter
Nozzle Dependent Based on Inner Diameter (2.5, 3.0, 4.0, 5.0, 6.0, 7.0,
8.0, 9.0, 10.0, 12.0, 14.0, 16.0, 20.0 mm Inner Diameter Nozzles
Solder Wave Height
4 mm (0.16") maximum
Solder Wave Height Adjustment
Controlled by Pump Motor RPM
Solder Wave Height Accuracy
±0.3 mm (±0.012")
Solder Capacity
Approx. 16 kg (35 lbs.)
Solder Melting Method
Indirect Heating with Cartridge Heaters
Solder Temperature
Ambient to 300 °C
Solder Melt Time at Startup
Approx. 30 min.


Program Storage
Internal Memory for 1000 Steps Per File, Number of Files Determined
by Hard Disc Drive
User Interface
Push-Button Controls and 15" Touch Screen Display

Utilities/Facilities Requirements

Machine Dimensions
1067 mm L x 1575 mm W x 1194 mm H
(42” x 62” x 47” )
Machine Weight
400kg (880lbs)
Power Source
200-220 VAC, Single Phase, 50/60 Hz, 4 KVA
Nitrogen Supply
0.4 - 0.5 MPa (60-75 psi); 25 l/min (0.9 CFM)


  • Eliminates time-consuming hand soldering operations and expensive wave soldering fixtures
  • Reduces risk of component overheating and PCB damage
  • High-precision X-Y-Z-axis drive moves the PCB over the stationary solder pot and flux jet, allowing for a compact design in a standalone machine
  • Flexible PCB holder with quick-release cam-locks enables fast loading and unloading of boards up to 380 x 460 mm (15" x 18")
  • Integral wave nozzle hood with built-in micro-preheater (controllable to 400 °C) shrouds soldering site with inert nitrogen and prevents oxidation
  • Bottom-side witness camera option provides real-time video inspection of the soldering process
  • Fully programmable point-to-point or continuous linear soldering
  • Variable solder pump speed and wave height control
  • Wide variety of dip height and dwell parameter settings
  • Built-in PC controller and Windows™-based software for on-line or off-line programming and unlimited program storage
  • Optional software for fast program generation via Gerber data import or scanned PCB image
  • Nozzle diameters from 2.5 mm to 20 mm (0.1" to 0.79")
  • Designed for both lead-free and conventional Sn/Pb solders
  • High-precision, pressurized air atomization nozzle for programmable selective fluxing
  • Utilizes selective soldering coordinate data to automatically generate selective fluxing operation
  • Built-in flux reservoir with hi-level/low-level alarms
  • Integral, 97 mm diameter (4") port for connection to factory exhaust

Benchtop Selective Fluxing Machine

  • High-Precision, Pressurized Air Atomization Nozzles and Programmable X-Y Drive Mechanism for Highly Controllable Selective Fluxing
  • Utilize Selective Soldering Data From TRZ to Generate Selective Fluxing Programs; Easily Download Data to SP Fluxer Using Windows™-Based Software and USB Interface
  • Flexible PCB Holder Handles Boards or Pallets Up to 330 mm x 250 mm (13" x 10")
  • Support Three or More TRZ Selective Soldering Systems with a Single SSP Fluxer
  • Keep Overspray and Sticky Flux Residue Away From Selective Soldering Equipment to Simplify Maintenance and Reduce Downtime
  • Weight Less Than 45 kg (100 lbs.)
  • Built-In Flux Reservoir with Hi-Level/Low-Level Alarms
  • Integral, 97 mm Diameter (4") Port for Connection to Factory Exhaust

Separate Fluxing Station Provides Important Advantages

The ULTIMA SSP handles boards or pallets up to 330 x 250 mm (the same size as the TRZ) and utilizes a high-precision, pressurized air atomization nozzle and X-Y drive mechanism with programmable speed for highly controllable selective fluxing. Among the many advantages of separating soldering and fluxing operations into separate machines are 1) the ability to keep overspray and sticky flux residue away out of the soldering mechanism and PCB positioner, 2) simplified maintenance, and 3) increased throughput by allowing soldering and fluxing to be performed simultaneously (in fact, a single SSP can serve as many as three TRZ systems).

Precision Spray Nozzle Delivers Precise, Uniform, Flux Application

The precision spray nozzle used in the ULTIMA SSP is capable of delivering round or very thin linear spray patterns with a very small amount of liquid flux. Independent pressure controls for its integral flux reservoir and atomizer allow the user to regulate the volume and density of the spray jet.

Selective Fluxing Programs Easily Generated From Soldering Data

Soldering programs for the TRZ are easily converted to selective fluxing programs by the ULTIMA Series software application and downloaded to the SSP via USB connection.

For equipment suggestions specific to your production needs, email sales@manncorp.com or contact one of our Sales Managers:

Chris Ellis - EAST COAST 215.869.8374

Ed Stone - WEST COAST 215.808.6266

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