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All Products In Category:  PBS Series

PBS Series Hot Bar Soldering Equipment

Hot Bar Soldering Systems

Manncorp Now Has the Solution to These Tough Soldering Challenges!

  • Flex Circuit to PCB
  • Ribbon Cable to PCB
  • Coaxial Cables
  • Fine Pitch SM Devices
  • Edge Connectors to PCB
  • Thermocompression Bonding
  • Tab to PCB, HSC to LCD or tab

Hot bar soldering is extremely effective in bonding components and parts that are dissimilar and difficult to unite. Several examples are listed above, but there are many other soldering situations that call for Manncorp's PBS hot bar reflow soldering system. This technology, also known as pulse bonding, differs from traditional soldering since the reflow process uses thermode technology, which is based on rapid reflow by pulse heating. This procedure allows materials with low temperature resistance to be soldered at high lead-free temperatures without damage to the flex. It selectively solders parts by heating them to a temperature that's high enough to cause their adhesive or solder to melt and then re-solidify to form a permanent bond.

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Chris — East Coast: 215.869.8374

Ed — West Coast: 215.808.6266

 PBS Series Hot Bar Soldering Systems


CCD Alignment Modules / Interposer (Option)
Adjustable fixture and single or dual CCD cameras are mounted on the frame for fine pitch magnification.

The Interposer protects the components during bonding process to improve the bonding strength. The Modules uses Polyimid (Kapton) tape or Silicon tape which is mounted on the Gantry. Feeding length and number of cycles before next feeding are programmable with sensor-controlled dual motors. System design prevents flux contamination on the Thermode.

Other PBS's features:
Heating profiles setup and adjustments are touch screen controlled. PID temperatures are attained quickly.

During the soldering/bonding cycle, temperature profile, time and pressure are displayed on the LCD screen in real time.

Digital control for the soldering/bonding pressure, is adjustable from 30 to 500N.

Titanium Flop-up Thermode Design
PBS bonding systems feature "Flop-up Thermode" which ensures ultra-fast heating and cooling cycle. Forced air-cooling further speeds up the operating cycle. Special Ti-alloy Thermode maintains co-planarity and withstands heating cycle deformation that is essential for the bonding process. This thermode also prevents voltage drop as current flows through the thermode from front-to-back instead of left-to-right, preventing damage to sensitive components during soldering.


PBS Series Hot Bar Soldering Systems - Specifications
PBS212 PBS213
Dimensions (Without Pressure regulator, handle & lamp) 665mm (Depth) x 668mm (Width) x 557m (Height) 665mm (Depth) x 668mm (Width) x 557m (Height)
Weight 50 Kg 60 Kg
Power Requirement 110 VAC 50/60Hz, 2KVA 110 VAC 50/60Hz, 2KVA
Air Supply Pressure 4 – 6 Kg/cm² 4 – 6 Kg/cm²
Fixture Height Maximum 50mm Maximum 50mm
Fixture Base Dimension 150mm x 150mm 150mm x 150mm
Table Actuation Type PBS202/203: Manual; PBS212/213: Pneumatic PBS202/203: Manual; PBS212/213: Pneumatic
Gantry Opening Width 400mm 400mm
Startup Operation Two Hand Control Two Hand Control
Sliding Stroke / Rotary Table Diameter 200mm 400mm
Vacuum 1 Set 2 Sets
Password 6 digits (2-level) 6 digits (2-level)
Thermode Specifications
Force Range 30N – 500N 30N – 500N
Force Accuracy ± 2 N ± 2 N
Actuation Type Pneumatic Pneumatic
Thermode Stroke 50mm 50mm
Thermode Length Maximum 100mm Maximum 100mm
Pulsed-heat Specifications
Heating Pulsed heating with High speed PID Control Pulsed heating with High speed PID Control
Preheat Temperature 50 – 500 °C (1 degree increment) 50 – 500 °C (1 degree increment)
Heat Temperature 50 – 500 °C (1 degree increment) 50 – 500 °C (1 degree increment)
Preheat Time 1 – 60 Second (1 second increment) 1 – 60 Second (1 second increment)
Heat Time 1 – 60 Second (1 second increment) 1 – 60 Second (1 second increment)
Temperature Accuracy ±2 °C ±2 °C
Cooling Temperature 50 – 256 °C 50 – 256 °C
Cooling Air Cooling Air Cooling
Programmable Profile 3 (Non-volatile Memory) 3 (Non-volatile Memory)
Thermocouple Type K Type K Type
Communication Specifications
Communication Port RS232 RS232

More Info

Manncorp's PBS hot bar reflow soldering system programs all elements of the soldering profile, including pressure, temperature, heat-up and cool-down times. The processing cycle, completed in just 12 to 15 seconds, begins by loading the PCB and flex into the fixture and fluxing the joint area. After the fixture is positioned into the work area, the cylinder lightly pushes the thermode against the parts, and once contact is made, it quickly heats up using high-speed PID to control temperature output. Peak reflow temperature is reached in 2 seconds or less.

When solder reflows, heating automatically stops and cool-down begins, lasting approximately 2 seconds, with topside-originating air assuring cooling uniformity. When solder has solidified, the cylinder automatically lifts to release the now-bonded parts.

Two versions of the PBS Systems are offered. PBS212 is a shuttle in/out processor, while PBS213 is a rotary machine that presents completed assemblies on a rotating axis for loading/unloading by operator. Both machines, which are lead-free compatible, offer vision systems with CCD camera and monitor as a low-cost option.


Flex Circuit to PCB


Wire Soldering

Bonding Fixture

HSC to PCB / HSC to LCD Bonding Fixture (With vacuum component holding under the LCD and PCB)

Adjustable Bonding Fixture (Work with CCD Alignment Modules)

Compare Chart

Comparison Chart: Manncorp's PBS212 & PBS213 vs. Competing Hot Bar Systems
Processing Speed High-Speed PID controls temperature output for faster heat-up & cycle time. Simple on/off control. Slower heat-up reduced temperature accuracy.
Heating Precision Phase control algorithm precisely heats thermode, prevents overheat. Lower cost solid state relay control cannot ensure no overheating.
Operating Simplicity User-friendly touch screen controls setup & soldering parameters. LCD display with press-button entry. Definitely not state of the art.
Process Display Real time temperature profile is on continuous display during soldering. No real time temperature profile.
Pressure Display Digital pressure control. Soldering force in Newton (N).is displayed. Pressure is displayed in MPa. Conversion must be done manually.
Footprint Size Only 665mm x 668mm x 557mm H. (26.2" x 26.3" x 22"H) Competing systems average about 1/3 larger than Manncorp systems.
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