PBS Series Hot Bar Soldering Equipment
Hot Bar Soldering Systems
Manncorp Now Has the Solution to These Tough Soldering Challenges!
- Flex Circuit to PCB
- Ribbon Cable to PCB
- Coaxial Cables
- Fine Pitch SM Devices
- Edge Connectors to PCB
- Thermocompression Bonding
- Tab to PCB, HSC to LCD or tab
Hot bar soldering is extremely effective in bonding components and parts that are dissimilar and difficult to unite. Several examples are listed above, but there are many other soldering situations that call for Manncorp's PBS hot bar reflow soldering system. This technology, also known as pulse bonding, differs from traditional soldering since the reflow process uses thermode technology, which is based on rapid reflow by pulse heating. This procedure allows materials with low temperature resistance to be soldered at high lead-free temperatures without damage to the flex. It selectively solders parts by heating them to a temperature that's high enough to cause their adhesive or solder to melt and then re-solidify to form a permanent bond.
Pictures
CCD Alignment Modules / Interposer (Option)
Adjustable fixture and single or dual CCD cameras are mounted on the frame for fine pitch magnification.
The Interposer protects the components during bonding process to improve the bonding strength. The Modules uses Polyimid (Kapton) tape or Silicon tape which is mounted on the Gantry. Feeding length and number of cycles before next feeding are programmable with sensor-controlled dual motors. System design prevents flux contamination on the Thermode.
Other PBS's features:
Heating profiles setup and adjustments are touch screen controlled. PID temperatures are attained quickly.
During the soldering/bonding cycle, temperature profile, time and pressure are displayed on the LCD screen in real time.
Digital control for the soldering/bonding pressure, is adjustable from 30 to 500N.
Titanium Flop-up Thermode Design
PBS bonding systems feature "Flop-up Thermode" which ensures ultra-fast heating and cooling cycle. Forced air-cooling further speeds up the operating cycle. Special Ti-alloy Thermode maintains co-planarity and withstands heating cycle deformation that is essential for the bonding process. This thermode also prevents voltage drop as current flows through the thermode from front-to-back instead of left-to-right, preventing damage to sensitive components during soldering.
Specifications
| PBS Series Hot Bar Soldering Systems - Specifications | ||
|---|---|---|
| PBS212 | PBS213 | |
| General | ||
| Dimensions (Without Pressure regulator, handle & lamp) | 665mm (Depth) x 668mm (Width) x 557m (Height) | 665mm (Depth) x 668mm (Width) x 557m (Height) |
| Weight | 50 Kg | 60 Kg |
| Power Requirement | 110 VAC 50/60Hz, 2KVA | 110 VAC 50/60Hz, 2KVA |
| Air Supply Pressure | 4 – 6 Kg/cm² | 4 – 6 Kg/cm² |
| Fixture Height | Maximum 50mm | Maximum 50mm |
| Fixture Base Dimension | 150mm x 150mm | 150mm x 150mm |
| Table Actuation Type | PBS202/203: Manual; PBS212/213: Pneumatic | PBS202/203: Manual; PBS212/213: Pneumatic |
| Gantry Opening Width | 400mm | 400mm |
| Startup Operation | Two Hand Control | Two Hand Control |
| Sliding Stroke / Rotary Table Diameter | 200mm | 400mm |
| Vacuum | 1 Set | 2 Sets |
| Password | 6 digits (2-level) | 6 digits (2-level) |
| Thermode Specifications | ||
| Force Range | 30N – 500N | 30N – 500N |
| Force Accuracy | ± 2 N | ± 2 N |
| Actuation Type | Pneumatic | Pneumatic |
| Thermode Stroke | 50mm | 50mm |
| Thermode Length | Maximum 100mm | Maximum 100mm |
| Pulsed-heat Specifications | ||
| Heating | Pulsed heating with High speed PID Control | Pulsed heating with High speed PID Control |
| Preheat Temperature | 50 – 500 °C (1 degree increment) | 50 – 500 °C (1 degree increment) |
| Heat Temperature | 50 – 500 °C (1 degree increment) | 50 – 500 °C (1 degree increment) |
| Preheat Time | 1 – 60 Second (1 second increment) | 1 – 60 Second (1 second increment) |
| Heat Time | 1 – 60 Second (1 second increment) | 1 – 60 Second (1 second increment) |
| Temperature Accuracy | ±2 °C | ±2 °C |
| Cooling Temperature | 50 – 256 °C | 50 – 256 °C |
| Cooling | Air Cooling | Air Cooling |
| Programmable Profile | 3 (Non-volatile Memory) | 3 (Non-volatile Memory) |
| Thermocouple Type | K Type | K Type |
| Communication Specifications | ||
| Communication Port | RS232 | RS232 |
More Info
Manncorp's PBS hot bar reflow soldering system programs all elements of the soldering profile, including pressure, temperature, heat-up and cool-down times. The processing cycle, completed in just 12 to 15 seconds, begins by loading the PCB and flex into the fixture and fluxing the joint area. After the fixture is positioned into the work area, the cylinder lightly pushes the thermode against the parts, and once contact is made, it quickly heats up using high-speed PID to control temperature output. Peak reflow temperature is reached in 2 seconds or less.
When solder reflows, heating automatically stops and cool-down begins, lasting approximately 2 seconds, with topside-originating air assuring cooling uniformity. When solder has solidified, the cylinder automatically lifts to release the now-bonded parts.
Two versions of the PBS Systems are offered. PBS212 is a shuttle in/out processor, while PBS213 is a rotary machine that presents completed assemblies on a rotating axis for loading/unloading by operator. Both machines, which are lead-free compatible, offer vision systems with CCD camera and monitor as a low-cost option.
Applications
Flex Circuit to PCB
TAB to PCB
Wire Soldering
Bonding Fixture
HSC to PCB / HSC to LCD Bonding Fixture (With vacuum component holding under the LCD and PCB)
Adjustable Bonding Fixture (Work with CCD Alignment Modules)
Compare Chart
| Comparison Chart: Manncorp's PBS212 & PBS213 vs. Competing Hot Bar Systems | ||
|---|---|---|
| CONDITION | PBS212 & PBS213 | COMPETING HOT BAR SYSTEMS |
| Processing Speed | High-Speed PID controls temperature output for faster heat-up & cycle time. | Simple on/off control. Slower heat-up reduced temperature accuracy. |
| Heating Precision | Phase control algorithm precisely heats thermode, prevents overheat. | Lower cost solid state relay control cannot ensure no overheating. |
| Operating Simplicity | User-friendly touch screen controls setup & soldering parameters. | LCD display with press-button entry. Definitely not state of the art. |
| Process Display | Real time temperature profile is on continuous display during soldering. | No real time temperature profile. |
| Pressure Display | Digital pressure control. Soldering force in Newton (N).is displayed. | Pressure is displayed in MPa. Conversion must be done manually. |
| Footprint Size | Only 665mm x 668mm x 557mm H. (26.2" x 26.3" x 22"H) | Competing systems average about 1/3 larger than Manncorp systems. |
