SDM-101 Manual PCB Depaneling Tool
The SDM-101 precision depaneler combines a topside circular cutter with a below-board linear knife for smooth, burr-free separation of PCBs along the scoring groove. The design of the SDM-101 eliminates stress on the board and the components during the separation process, preventing post-breakout-related board, component and solder joint defects even when components are located as close as 1 mm to the scoring line. SDM-101 can be used with panels that are v-scored in the X direction or X & Y directions and PCB thicknesses from 0.8 mm to 3.0 mm. The large processing table can be angled to permit processed boards to fall away. This low-maintenance PCB separator requires no power or air for $0 utility costs and the ability to use the machine anywhere in the facility. Sturdy, heavy-duty design. A shatterproof Plexiglas safety shield protects operator from cutting blade.
Specifications
| PCB Thickness | 0.8 mm to 3.0 mm |
| Maximum Depaneling Length | 445 mm (17.5") or 483 mm (19") |
V-Scoring Lines Specs: |
|
| Depaneling Mode | Manual |
| Separating Speed | Dependent on operator |
| Production Rate | Moderate volume |
| Scoring Angle | 20˚ |
| Minimum Component Distance from V-Groove | 1 mm |
| Maximum Component Height | 32 mm (1.26") |
| PCB Materials | FR4, CEM3, etc. |
| Processing table | 500 x 165 mm (19.7" x 6.5") |
| Dimensions (L x W x H) | 750 mm x 240 mm x 742 mm (29.5" x 9.4" x 18.5") |
| Net Weight | 32 kg (70.5 lbs) |
| Shipping Weight | 66 kg (146 lbs) |
