SDM-101 Manual PCB Depaneling Tool
The SDM-101 precision depaneler combines a topside circular cutter with a below-board linear knife for smooth, burr-free separation of PCBs along the scoring groove. The design of the SDM-101 eliminates stress on the board and the components during the separation process, preventing post-breakout-related board, component and solder joint defects even when components are located as close as 1 mm to the scoring line. SDM-101 can be used with panels that are v-scored in the X direction or X & Y directions and PCB thicknesses from 0.8 mm to 3.0 mm. The large processing table can be angled to permit processed boards to fall away. This low-maintenance PCB separator requires no power or air for $0 utility costs and the ability to use the machine anywhere in the facility. Sturdy, heavy-duty design. A shatterproof Plexiglas safety shield protects operator from cutting blade.
|PCB Thickness||0.8 mm to 3.0 mm|
|Maximum Depaneling Length||460 mm (18.1") or 600 mm (24")|
|V-Scoring Lines Specs:
|Separating Speed||Dependent on operator|
|Production Rate||Moderate volume|
|Minimum Component Distance from V-Groove||1 mm|
|Maximum Component Height||32 mm (1.26")|
|PCB Materials||FR4, CEM3, etc.|
|Processing table||500 x 165 mm (19.7" x 6.5")|
|Dimensions (L x W x H)||750 mm x 240 mm x 742 mm
(29.5" x 9.4" x 18.5")
|Net Weight||32 kg (70.5 lbs)|
|Shipping Weight||66 kg (146 lbs)
Submitting Form. Please Wait...
A new user account has been created for you and an email with your user name and password was sent to the email address you supplied.
When you close this form you will be logged in and will be able to see all pricing and request quotes or purchase products.
On future visits simply login.
You can contact us directly by phone at 215.830.1200 or send an email to firstname.lastname@example.org.