Versatility for Any Wave Soldering Application
28.350 can be configured with dual waves to accommodate through-hole, surface mount and mixed-technology assemblies. The chip wave can be deactivated through the user interface for non-SMT applications, although the addition of the oscillating wave option will allow the chip wave to aid in hole fill and bridge reduction for difficult-to-solder boards of all technologies.
The standard maximum wave width of 350 mm (13.8") can be adjusted, relative to PCB dimensions, through the use of an optional wave reducer mechanism and helps to minimize dross formation. Board interval sensing for wave activation and an energy-saving standby mode also aid in dross reduction.
The solder module is driven by two heavy-duty, transducer-controlled 1/4 HP motors to ensure precise, uniform wave heights.
One titanium-alloy lead-free-ready solder pot with a 200 kg (440 lbs Approximate weight for lead free solder) capacity comes standard with the 28.350. The solder pot is mounted to a heavy-duty, roll-out carriage assembly that allows for easy access and maintenance. For assemblers that have not entirely phased out lead-based solders, a second pot with a quick-connect socket can be added for easy conversion between lead-based and lead-free solders.
Internal Automatic Spray Fluxer
The 28.350 includes an automatic internal spray fluxing system in which a precision spray nozzle assembly is mounted to a reciprocating Y-axis drive mechanism to ensure even and accurate application of flux.
The system adjusts automatically to accommodate the PCB size and utilizes a high-precision, low-pressure atomizer to provide excellent coating and through-hole penetration.
Contamination can be avoided when switching flux types with the 28.350's optional dual fluxer system. Dual spray fluxers permit instant and easy switchover from one flux type to another without messy clean-ups. Two separate nozzles, two flux tanks and two lines prevent cross contamination.
Two Independently Controlled Convection Preheating Zones
After flux application, boards enter a two-zone high-capacity forced hot air convection preheat with independent zone temperature controls to allow precise thermal profiling for proper flux activation and optimal solder wetting as assemblies enter the wave module.
If additional profiling control is needed, or for assemblies sensitive to top and bottom side temperature differential, a top-side preheater can be added at minimal cost.
Easy Conveyor Adjustment Reduces Setup Time and Ensures Process Repeatability
Motorized conveyor width adjustment, from 50-350 mm (2"-13.8"), is standard on all 28.350 wave soldering systems, dramatically reducing setup time and eliminating operator inconsistency.
An aluminum-alloy pin-type conveyor input mechanism feeds the dual-titanium-finger conveyor, which includes a built-in finger cleaner, closed-loop speed control and overload protection.
Conveyor angle is adjustable from 4° - 7° and nominal speed setting is variable from 0.5-2.2 m/min (20"-87"/min) for maximized throughput.
An optional center PCB support rail can be added to maintain planarity and to prevent sagging of oversize boards through the wave module.
Automate Production with Inlet and Unload Conveyors
Manncorp's WL-100M-L1 inlet conveyor and WU-120M-H1 belt unloader are specially designed for wave solder systems.
WL-100M-L1 is a fully adjustable, chain-type inlet conveyor designed for feeding assemblies up to 350 mm (13.78") wide directly into the wave solder machine. Travel speed, conveyor angle and conveyor height are all adjustable. Construction is heavy-duty aluminum
WU-120M-H1, with its non-slip, heat-resistant belt, unloads soldered assemblies from wave soldering equipment. Height, angle and speed are adjustable. The speed is variable from 0.5-8m/min so that PCBs are transferred smoothly and safely from the wave soldering system to operators or other handling equipment of the user's choice.
|Wave Width||350 mm (13.8")|
|Wave Height||10 mm (0.4")|
|Preheat Length||1300 mm (51")|
|Conveyor Width||50 - 350 mm (2" - 13.8")|
|Maximum PCB Size||350 mm (13.8") width|
|Conveyor Speed||0.5 - 2.2 m/min (20" - 87"/min)|
|Conveyor Angle||4° to 7° (adjustable)|
|Fluxing||Internal spray fluxer |
Dual spray fluxing optional
|Solder Pot||Single lead-free pot standard |
Two pots-one lead-free, one standard-optional
|Solder Capacity||200 kg (440 lbs. approximate weight for lead free solder)|
|Solder Temperature||Ambient - 300°C (Ambient - 572°F)|
|Control Method||Color Touch Screen / PLC|
|Machine Dimensions||3500 mm (138") L x 1390 mm (55") W x 1600 mm (63") H|
|Net Weight||990 kg (2180 lbs.)|
|Exhaust Fan Requirements||250 cfm (Solder Pot Exhaust) 10" Diameter |
Spray Fluxer Exhause Fan built into machine
|Air Pressure Requirements||0.4 MPa (60 psi)|
|Total Power Consumption||220 V, 3-Phase, 50/60 Hz 23.7 KW, 70A|