MC301N Benchtop Batch Reflow Oven w/Nitrogen Connection

Nitrogen Compatible Batch SMT Reflow Oven MC301N from Manncorp
MC301N Benchtop Nitrogen Reflow Oven
MC301N Benchtop Nitrogen Reflow Oven
MC301N Benchtop Nitrogen Reflow Oven
MC301N Benchtop Nitrogen Reflow Oven
MC301N Benchtop Nitrogen Reflow Oven
MC301N Benchtop Nitrogen Reflow Oven
MC301N Benchtop Nitrogen Reflow Oven
MC301N Benchtop Nitrogen Reflow Oven

MC301N Benchtop Batch Reflow Oven w/Nitrogen Connection

Match your solder paste manufacturers' precise specifications for preheat, soak, reflow, and cooling with the MC301N Nitrogen Batch Reflow Oven. By simulating the conditions of an inline reflow system in a benchtop unit, the MC301N is ideal for product development, prototyping, and manufacturability testing. Detailed solder profiles are easily programmed, stored, and downloaded through the MC301N's exclusive hardware control app and Android operating system. Android architecture also allows users to take advantage of touch screen operation and integrated wireless networking for data transfer. Connection for nitrogen input and integrated flow controller included.

This item ships by freight. If you purchase it through our online store, our sales team will send you a quote for the freight costs after purchase.

Regular price $8,495.00
Chris Ellis  215-869-8374 | East Coast
Ed Stone 215-808-6266 | West Coast

Design Ideal for Labs and Small-Scale Production

Measuring only 27.2" L x 18.9" W x 11" H (690 mm L x 480 mm W x 280 mm H), the MC301N easily installs on virtually any benchtop. Its ability to simulate inline reflow profiles with preheat, soak, reflow, and cooling phases makes it a great choice for labs or other installations where space is often at a premium. The front-loading heating chamber has an effective soldering area of 9.84" x 7.87" (250 x 200 mm) and includes a window for viewing of the soldering process.

Easy Installation - Up and Running in No Time

The MC301N has an average power rating of 3.6 KW (6.3 KW, peak) and requires a 220-240V, single-phase, voltage supply rated at 30 amps. Built-in circulation fans provide air flow for heating and cooling, and hot air is exhausted through a 2.5" flanged outlet on the rear of the unit. For removal of flux fumes, it is recommended to hook up a non active flexible hose or a vent hood.

Exclusive Android-Based Control Application

The MC301N Android-based control app provides an easy-to-use, touch-panel interface with virtual keyboard for setting the temperature and duration of the preheat, soak, reflow, and cooling stages. In the reflow zone, the user can specify the dwell at both the melting and peak temperatures. Based on these settings, the system will also automatically calculate the heating or cooling rate in each stage for verification with solder paste and component manufacturers' specifications. In addition, when heater control is based on the higher temperature measured at the heaters, the system displays the calculated board temperature based on a calibrated offset.

Real-Time Temp Control via On-Board TC

In the MC301N's password-protected advanced settings, the unit can be switched into a separate control mode that uses real-time feedback from a built-in, flying thermocouple. In this mode, with the thermocouple attached at a strategic location on the PCB surface, heater control is based on the actual temperature measured at the thermocouple. As you can see in this screen capture, the target temperature is equal to the thermocouple temperature and there is no offset.

Temp Recordings Easily Saved & Distributed via WiFi

In the run mode, the high-resolution touch-panel displays a graphical representation of the heat zone temperature (red) versus the PCB temperature (yellow) throughout the reflow cycle. For process control and traceability, screens can be saved as separate files and distributed electronically via Email or across networks using the Android OS and built-in WiFi capability.

MC301N Specifications
Applicable Solder Types Lead-Free or SnPb
Heating Method IR & Forced Hot Air Convection
User Interface Android Software Platform
Ultra High Resolution Touchscreen
Integrated WiFi & Networking
Effective Soldering Area 9.84" x 7.87" (250 mm x 200 mm)
Temperature Range Ambient - 310 °C
Temperature Precision ±2 °C
Temperature Control Method PID Control; SSR Contactless Switch Circuit
Warm-Up Time Approx. 2.5 min.
Power 3.6 KW (avg.); 6.3 KW (max.)
Voltage 220 V, Single Phase, 50/60 Hz
Nitrogen Input Pressure 0.6MPa (87 psi)
Maximum Flow Rate 120 to 150 l/min
N2 Gas Flow Software Programmable
Oxygen Level 3000 ppm with 5 l/min
Exhaust Temperature (approx.) 60°C
Dimensions 27.2" L x 18.9" W x 11" H
(690 mm L x 480 mm W x 280 mm H)
Weight Approx. 208 lbs. (95 kg)

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MC301 Benchtop Batch Reflow Oven
  • Soldering Area: 250 mm x 200 mm
  • Preheat, Soak, Reflow, & Cooling
  • Size: 29.2” L x 23.75” W x 12.5” H