| PCB Holder and X-, Y-, Z-Axis Drive Mechanism |
|---|
| Maximum PCB Size |
330 mm x 250 mm (13" x 10");
460 mm x 380 mm (18" x 15") optional |
| Minimum PCB Size |
50 mm x 50 mm (2" x 2") |
| PCB Thickness |
0.8 mm - 2.0 mm (.032" - .080") |
| PCB Warp |
0.5 mm (0.020") maximum |
| Maximum PCB Weight |
2 kg (4.4 lbs.) including components;
4 kg (8.8 lbs.) capacity optional |
| Component Lead Length |
3 mm (0.12") recommended maximum |
| Component Height (Top Side) |
50 mm (2") maximum above PCB top side |
| Component Height (Bottom Side) |
Soldering path programmable to avoid components and assemblies mounted on bottom side. Click here for diagram with maximum and minimum dimensions. |
| PCB Edge Clearance |
3 mm (0.12") for components;
5 mm (0.20") for solder pad edge |
| Positional Accuracy |
±0.1 mm (±0.004") |
| X-Axis Resolution |
0.032 mm (0.0013") |
| Y-Axis Resolution |
0.033 mm (0.0013") |
| Z-Axis Resolution |
0.008 mm (0.0003") 50cm2/sec |
| Travel Speed (While Soldering) |
Programmable from 0.1 mm/sec - 10.0 mm/sec
(0.004"/sec - 0.4"/sec) |
| Travel Speed (Between Points) |
400 mm/sec (15.75"/sec) maximum |
| Nitrogen Preheater |
|---|
| Heating Method |
Micro Heater and Temperature Sensor Integrated with Nozzle Hood |
| Temperature Range |
Ambient to 400 °C (Inside Nozzle Hood) |
| Heater Power |
1.3 KW x 1 pc. |
| Nitrogen Consumption |
25 liters/min |
| Nitrogen Flow Control |
Digital Flowmeter and Pressure Regulator |
| Solder Wave and Bath |
|---|
| Solder Types |
Both Lead-Free and Conventional Sn/Pb Solders; Second Separate Solder Pot Recommended When Using Both Types |
| Wave Diameter |
Nozzle Dependent Based on Inner Diameter (2.5, 3.0, 4.0, 5.0, 6.0, 7.0, 8.0, 9.0, 10.0, 12.0, 14.0, 16.0, 20.0 mm Inner Diameter Nozzles Available) |
| Solder Wave Height |
4 mm (0.16") maximum |
| Solder Wave Height Adjustment |
Controlled by Pump Motor RPM |
| Solder Wave Height Accuracy |
±0.3 mm (±0.012") |
| Solder Capacity |
Approx. 16 kg (35 lbs.) |
| Solder Melting Method |
Indirect Heating with Cartridge Heaters |
| Solder Temperature |
Ambient to 300 °C |
| Solder Melt Time at Startup |
Approx. 30 min. |
| Controller |
|---|
| Program Storage |
Internal Memory for 40 Files, 100 Steps Per File; Unlimited Off-Line Storage with PC Connected via USB Port and Windowsª-Based Software |
| User Interface |
Push-Button and Integral LCD Display on TR2 Base; Windows®-Based Software for Off-Line Programming and Data Transfer |
| Utilities/Facilities Requirements |
|---|
| Machine Dimensions |
920 mm L x 790 mm W x 542 mm H
(36.25" x 31.1" x 21.3") |
| Machine Weight |
97 kg (215 lbs.)
Including 16 kg (35 lb.) Solder Capacity |
| Power Source |
208-240 VAC, Single Phase, 50/60 Hz, 4 KVA |
| Nitrogen Supply |
0.4 - 0.5 MPa (60-75 psi); 25 l/min (0.9 CFM)
|
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